SCHEMBL2773353

SCHEMBL2773353

C(=C(c1ccccc1)c1ccccn1)c1ccccc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 2/20 0.56
CYP11B2 P19099 2/20 0.56
NPC1 O15118 4/20 0.56
RAB9A P51151 4/20 0.56
PKM P14618 2/20 0.56
POLB P06746 2/20 0.56
TDP1 Q9NUW8 1/20 0.55
LMNA P02545 2/20 0.53
MAPT P10636 2/20 0.53
KDM4E B2RXH2 1/20 0.53
KMT2A Q03164 3/20 0.52
ESR1 P03372 1/20 0.48
NAPRT Q6XQN6 1/20 0.47
P4HTM Q9NXG6 1/20 0.47
L3MBTL1 Q9Y468 1/20 0.47
ALDH1A1 P00352 2/20 0.47
SMN1; SMN2 Q16637 1/20 0.47
GAA P10253 1/20 0.44
EGFR P00533 1/20 0.44
IGF1R P08069 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31574014 0.86 CYP19A1 (0.62) CYP19A1CYP11B2NPC1RAB9APKM
SCHEMBL22406568 0.82 NPC1 (0.47) CYP19A1CYP11B2NPC1RAB9APKM
SCHEMBL22406586 0.82 NPC1 (0.47) CYP19A1CYP11B2NPC1RAB9APKM
SCHEMBL19359205 0.82 NPC1 (0.47) CYP19A1CYP11B2NPC1RAB9APKM
SCHEMBL28961178 0.81 CYP19A1 (0.66) CYP19A1CYP11B2NPC1RAB9APKM
SCHEMBL22660166 0.81 KMT2A (0.55) CYP19A1CYP11B2NPC1RAB9APKM
SCHEMBL29071871 0.81 CYP19A1 (0.60) CYP19A1CYP11B2NPC1RAB9APKM
SCHEMBL9250759 0.79 RAB9A (0.61) NPC1RAB9APKMPOLBTDP1
SCHEMBL28714886 0.78 CYP19A1 (0.49) CYP19A1CYP11B2NPC1RAB9APKM
SCHEMBL28714885 0.78 CYP19A1 (0.49) CYP19A1CYP11B2NPC1RAB9APKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024244098-A1 ELECTROLYTE ADDITIVE FOR ELECTROLYTIC COPPER FOIL, AND HIGH-TENSILE STRENGTH AND HIGH-ELONGATION ELECTROLYTIC COPPER FOIL AND PRODUCTION METHOD THEREFOR 九江德福科技股份有限公司 2024-12-05 WO claimed
CN-116590762-A Electrolyte additive for electrolytic copper foil, high-resistance high-ductility electrolytic copper foil and production method thereof 九江德福科技股份有限公司 2023-08-15 CN claimed
US-20100302927-A1 OPTICAL DATA STORAGE MEDIUM AND METHODS FOR USING THE SAME GENERAL ELECTRIC COMPANY (US) 2010-12-02 US claimed
WO-2024244098-A1 ELECTROLYTE ADDITIVE FOR ELECTROLYTIC COPPER FOIL, AND HIGH-TENSILE STRENGTH AND HIGH-ELONGATION ELECTROLYTIC COPPER FOIL AND PRODUCTION METHOD THEREFOR 九江德福科技股份有限公司 2024-12-05 WO disclosed
CN-116590762-A Electrolyte additive for electrolytic copper foil, high-resistance high-ductility electrolytic copper foil and production method thereof 九江德福科技股份有限公司 2023-08-15 CN disclosed
WO-2007110540-A2 DYEING COMPOSITION CONTAINING A THIOL/DISULPHIDE FLUORESCENT COLORANT COMPRISING AN ALKOXY/HYDROXY GROUPING, WITH AN INTERNAL CATIONIC CHARGE, AND METHOD FOR LIGHTENING KERATIN MATERIALS USING SAID COLORANT L'OREAL (FR) 2007-10-04 WO disclosed