⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1784616 | 0.94 | — | — | |
| Water SCHEMBL10861005 | 0.89 | — | — | |
| Hydrochloric Acid SCHEMBL10449337 | 0.89 | — | — | |
| SCHEMBL3628799 | 0.76 | — | — | |
| Perchlorate SCHEMBL3298579 | 0.74 | — | — | |
| Acetic Acid SCHEMBL5986264 | 0.71 | FFAR3 (0.50) | — | |
| SCHEMBL1164837 | 0.71 | — | — | |
| SCHEMBL9490932 | 0.70 | — | — | |
| Fluoride SCHEMBL1054216 | 0.70 | — | — | |
| SCHEMBL142963 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118726003-A | Application of wafer surface treatment liquid | 上海新阳半导体材料股份有限公司 | 2024-10-01 | — | — | CN | claimed |
| CN-118726000-A | Preparation method of fluoride-containing wafer surface treatment liquid | 上海新阳半导体材料股份有限公司 | 2024-10-01 | — | — | CN | claimed |
| CN-118726012-A | Preparation method of wafer surface treatment liquid | 上海新阳半导体材料股份有限公司 | 2024-10-01 | — | — | CN | claimed |
| CN-118725999-A | Application of fluoride-containing wafer surface treatment liquid | 上海新阳半导体材料股份有限公司 | 2024-10-01 | — | — | CN | claimed |
| CN-118726004-A | Fluoride-containing wafer surface treatment liquid | 上海新阳半导体材料股份有限公司 | 2024-10-01 | — | — | CN | claimed |
| CN-117683590-A | Fluorine-containing cleaning fluid composition and application thereof | 湖北兴福电子材料股份有限公司 | 2024-03-12 | — | — | CN | claimed |
| CN-109971565-B | Fluorine-containing cleaning solution | 安集微电子（上海）有限公司 | 2021-10-22 | — | — | CN | claimed |
| CN-108121175-B | Fluorine-containing cleaning solution | 安集微电子科技（上海）股份有限公司 | 2021-02-02 | — | — | CN | claimed |
| CN-111363631-A | Degumming agent for deburring and preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2020-07-03 | — | — | CN | claimed |
| CN-110669597-A | Fluorine-containing cleaning solution | 安集微电子科技（上海）股份有限公司 | 2020-01-10 | — | — | CN | claimed |
| CN-101957563-B | Fluorine-containing plasma etching residue cleaning solution | ANJI MICROELECTRONICS SHANGHAI | 2014-09-24 | — | — | CN | claimed |
| CN-103809394-A | Cleaning fluid for removing light-resistance etching residues | ANJI MICROELECTRONICS TECHNOLOGY SHANGHAI CO LTD | 2014-05-21 | — | — | CN | claimed |
| CN-102047184-B | Plasma etching residue cleaning solution | ANJI MICROELECTRONICS CO LTD | 2013-10-23 | — | — | CN | claimed |
| CN-101666984-B | Plasma etching residue cleaning solution | ANJI MICROELECTRONICS TECHNOLOGY CO LTD | 2012-08-22 | — | — | CN | claimed |
| CN-102227518-A | Fluorine contained composition and application thereof | ANJI MICROELECTRONICS | 2011-10-26 | — | — | CN | claimed |
| CN-102047184-A | Plasma etching residue cleaning solution | ANJI MICROELECTRONICS CO LTD | 2011-05-04 | — | — | CN | claimed |
| CN-101957563-A | Fluorine-containing plasma etching residue cleaning solution | ANJI MICROELECTRONICS SHANGHAI | 2011-01-26 | — | — | CN | claimed |
| CN-101827927-A | Plasma etching residue cleaning solution | ANJI MICROELECTRONICS SHANGHAI CO LTD | 2010-09-08 | — | — | CN | claimed |
| CN-101827926-A | Plasma etching residue cleaning solution | ANJI MICROELECTRONICS SHANGHAI CO LTD | 2010-09-08 | — | — | CN | claimed |
| CN-101666984-A | Plasma etching residue cleaning solution | ANJI MICROELECTRONICS TECHNOLO | 2010-03-10 | — | — | CN | claimed |