SCHEMBL278349

SCHEMBL278349

Cc1cc(O)c(C2CCCCC2)cc1C(C)(C)c1cccc(C(C)(C)c2cc(C3CCCCC3)c(O)cc2C)c1

nearest known ligand 0.37

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 3/20 0.37
ESR2 Q92731 2/20 0.37
NUDT1 P36639 1/20 0.36
BACE1 P56817 1/20 0.36
HSP90AA1 P07900 1/20 0.36
PTPN5 P54829 4/20 0.36
PTPN2 P17706 1/20 0.36
HDAC4 P56524 1/20 0.33
HDAC2 Q92769 1/20 0.33
HDAC8 Q9BY41 1/20 0.33
CNR1 P21554 2/20 0.33
CNR2 P34972 1/20 0.32
ACMSD Q8TDX5 1/20 0.32
CYP1A2 P05177 2/20 0.32
CYP2D6 P10635 2/20 0.32
CYP2C19 P33261 2/20 0.32
CYP2C9 P11712 1/20 0.31
GAA P10253 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30320299 1.00 ESR1 (0.37) ESR1ESR2NUDT1BACE1HSP90AA1
SCHEMBL29623208 1.00 ESR1 (0.37) ESR1ESR2NUDT1BACE1HSP90AA1
SCHEMBL8656679 0.92 ESR1 (0.38) ESR1ESR2NUDT1BACE1HSP90AA1
SCHEMBL29623065 0.90 ESR1 (0.39) ESR1ESR2NUDT1BACE1HSP90AA1
SCHEMBL278477 0.90 ESR1 (0.39) ESR1ESR2NUDT1BACE1HSP90AA1
SCHEMBL30320264 0.90 ESR1 (0.39) ESR1ESR2NUDT1BACE1HSP90AA1
SCHEMBL30104451 0.87 NUDT1 (0.39) ESR1NUDT1BACE1HSP90AA1CNR1
SCHEMBL278354 0.86 ESR1 (0.40) ESR1ESR2NUDT1BACE1HSP90AA1
SCHEMBL29623048 0.86 ESR1 (0.40) ESR1ESR2NUDT1BACE1HSP90AA1
SCHEMBL15625210 0.86 NUDT1 (0.36) ESR1NUDT1BACE1HSP90AA1PTPN5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023024783-A1 POSITIVE PHOTORESIST AND PREPARATION METHOD, PREPARATION METHOD FOR GLASS HOUSING, AND ELECTRONIC DEVICE OPPO广东移动通信有限公司 2023-03-02 WO claimed
US-20160223908-A1 PHOTOSENSITIVE COMPOSITIONS AND APPLICATIONS THEREOF PROMERUS, LLC (US) 2016-08-04 US claimed
US-9341949-B2 Photosensitive compositions and applications thereof PROMERUS, LLC (US) 2016-05-17 US claimed
US-20140322647-A1 PHOTOSENSITIVE COMPOSITIONS AND APPLICATIONS THEREOF SUMITOMO BAKELITE CO., LTD (JP) 2014-10-30 US claimed
WO-2024135717-A1 THERMOPLASTIC RESIN AND OPTICAL LENS INCLUDING SAME 三菱瓦斯化学株式会社 2024-06-27 WO disclosed
WO-2023024783-A1 POSITIVE PHOTORESIST AND PREPARATION METHOD, PREPARATION METHOD FOR GLASS HOUSING, AND ELECTRONIC DEVICE OPPO广东移动通信有限公司 2023-03-02 WO disclosed
CN-106933034-B Positive photoresist composition 东京应化工业株式会社 2023-01-06 CN disclosed
US-11537045-B2 Photosensitive compositions and applications thereof PROMERUS, LLC (US) 2022-12-27 US disclosed
EP-4045564-A1 PHOTOSENSITIVE COMPOSITIONS AND APPLICATIONS THEREOF Promerus, LLC (US) 2022-08-24 EP disclosed
CN-114555674-A Photosensitive composition and application thereof 普罗米鲁斯有限责任公司 2022-05-27 CN disclosed
WO-2021076131-A1 PHOTOSENSITIVE COMPOSITIONS AND APPLICATIONS THEREOF PROMERUS, LLC (US) 2021-04-22 WO disclosed
US-20210116807-A1 PHOTOSENSITIVE COMPOSITIONS AND APPLICATIONS THEREOF PROMERUS, LLC (US) 2021-04-22 US disclosed
US-6475694-B2 MIXTURE OF ALKALI SOLUBLE RESIN, QUINONEDIAZIDE ESTER COMPOUND AND COMPOUND WHICH GENERATES AN ACID UPON EXPOSUR ETO RADIATION TOKYO OHKA KOGYO CO., LTD. (JP) 2002-11-05 US disclosed
US-6417317-B1 CONDENSATION POLYMERIZATION OF TRIFUNCTIONAL PHENOLIC COMPOUND WITH ORTHO- AND PARA-POSITIONED HYDROGENS IN PRESENCE OF ALDEHYDE OR KETONE; POSITIVE PHOTORESISTS, COATINGS; HEAT RESISTANCE TOGYO OHKA KOGYO CO., LTD. (JP) 2002-07-09 US disclosed
US-20020001769-A1 Positive photoresist composition TOKYO OHKA KOGYO CO., LTD. 2002-01-03 US disclosed
US-20010024762-A1 Phenol novolak resin, production process thereof, and positive photoresist composition using the same TOKYO OHKA KOGYO CO., LTD. (JP) 2001-09-27 US disclosed
US-6207788-B1 FROM 2,6-DIMETHYLOL-4-METHYLPHENOL AND BIS(2,5-DIMETHYL-4-HYDROXYPHENYL)METHANE TOKYO OHKA KOGYA CO., LTD. (JP) 2001-03-27 US disclosed
US-6187500-B1 PHOTORESIST MATERIAL COMPRISING BLEND OF ALKALI-SOLUBLE NOVOLAK RESIN AND A 1,2-NAPHTHOQUINONEDIAZIDE-5-SULFONIC ESTER; FINE RESOLUTION TOKYO OHKA KOGYO CO., LTD. (JP) 2001-02-13 US disclosed
US-6030741-A SOLVENT CONTAINING A MIXTURE OF HEPATANONE-2, ETHYL ACETATE AND A HIGH BOILING BENZYL SALICYLATE; RESIST PATTERN EXHIBITING PHOTOSENSITIVITY LESS VARIABLE RELATIVE TO ITS THICKNESS; SUPERIOR SHAPE-PROFILING TOKYO OHKA KOGYO CO., LTD. (JP) 2000-02-29 US disclosed
EP-0902326-A2 Novolak resin precursor, novolak resin and positive photoresist composition containing the novolak resin TOKYO OHKA KOGYO CO., LTD. (JP) 1999-03-17 EP disclosed