SCHEMBL278477

SCHEMBL278477

Cc1cc(O)c(C2CCCCC2)cc1C(C)(C)c1ccc(C(C)(C)c2cc(C3CCCCC3)c(O)cc2C)cc1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 3/20 0.39
NUDT1 P36639 1/20 0.38
BACE1 P56817 1/20 0.38
HSP90AA1 P07900 1/20 0.38
RXRA P19793 1/20 0.36
CYP1A2 P05177 2/20 0.36
CYP2D6 P10635 2/20 0.36
CYP2C19 P33261 2/20 0.36
CNR1 P21554 1/20 0.35
ACMSD Q8TDX5 2/20 0.34
PTGDR2 Q9Y5Y4 2/20 0.33
CYP2C9 P11712 2/20 0.33
PSMB5 P28074 1/20 0.32
CACNA1B Q00975 1/20 0.32
CYP3A4 P08684 2/20 0.32
ESR2 Q92731 2/20 0.32
AR P10275 1/20 0.32
HPGD P15428 1/20 0.32
TSHR P16473 1/20 0.32
SLC6A2 P23975 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29623065 1.00 ESR1 (0.39) ESR1NUDT1BACE1HSP90AA1RXRA
SCHEMBL30320264 1.00 ESR1 (0.39) ESR1NUDT1BACE1HSP90AA1RXRA
SCHEMBL278354 0.96 ESR1 (0.40) ESR1NUDT1BACE1HSP90AA1RXRA
SCHEMBL15625210 0.96 NUDT1 (0.36) ESR1NUDT1BACE1HSP90AA1RXRA
SCHEMBL29623048 0.96 ESR1 (0.40) ESR1NUDT1BACE1HSP90AA1RXRA
SCHEMBL8656679 0.93 ESR1 (0.38) ESR1NUDT1BACE1HSP90AA1RXRA
SCHEMBL30104451 0.91 NUDT1 (0.39) ESR1NUDT1BACE1HSP90AA1CYP1A2
SCHEMBL278349 0.90 ESR1 (0.37) ESR1NUDT1BACE1HSP90AA1CYP1A2
SCHEMBL30320299 0.90 ESR1 (0.37) ESR1NUDT1BACE1HSP90AA1CYP1A2
SCHEMBL29623208 0.90 ESR1 (0.37) ESR1NUDT1BACE1HSP90AA1CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160223908-A1 PHOTOSENSITIVE COMPOSITIONS AND APPLICATIONS THEREOF PROMERUS, LLC (US) 2016-08-04 US claimed
US-9341949-B2 Photosensitive compositions and applications thereof PROMERUS, LLC (US) 2016-05-17 US claimed
US-20140322647-A1 PHOTOSENSITIVE COMPOSITIONS AND APPLICATIONS THEREOF SUMITOMO BAKELITE CO., LTD (JP) 2014-10-30 US claimed
CN-106933034-B Positive photoresist composition 东京应化工业株式会社 2023-01-06 CN disclosed
US-11537045-B2 Photosensitive compositions and applications thereof PROMERUS, LLC (US) 2022-12-27 US disclosed
EP-4045564-A1 PHOTOSENSITIVE COMPOSITIONS AND APPLICATIONS THEREOF Promerus, LLC (US) 2022-08-24 EP disclosed
CN-114555674-A Photosensitive composition and application thereof 普罗米鲁斯有限责任公司 2022-05-27 CN disclosed
US-20210116807-A1 PHOTOSENSITIVE COMPOSITIONS AND APPLICATIONS THEREOF PROMERUS, LLC (US) 2021-04-22 US disclosed
WO-2021076131-A1 PHOTOSENSITIVE COMPOSITIONS AND APPLICATIONS THEREOF PROMERUS, LLC (US) 2021-04-22 WO disclosed
US-9696623-B2 Photosensitive compositions and applications thereof PROMERUS, LLC (US) 2017-07-04 US disclosed
US-20160223908-A1 PHOTOSENSITIVE COMPOSITIONS AND APPLICATIONS THEREOF PROMERUS, LLC (US) 2016-08-04 US disclosed
US-6207340-B1 POSITIVE PHOTORESISTS ALKALI-SOLUBLE RESIN; (B) A NAPHTHOQUINONEDIAZIDE GROUP-CONTAINING COMPOUND; AND (C) A SOLVENT FOR PATTERN IMAGES TOKYO OHKA KOGYO CO., LTD. (JP) 2001-03-27 US disclosed
US-6207788-B1 FROM 2,6-DIMETHYLOL-4-METHYLPHENOL AND BIS(2,5-DIMETHYL-4-HYDROXYPHENYL)METHANE TOKYO OHKA KOGYA CO., LTD. (JP) 2001-03-27 US disclosed
US-6187500-B1 PHOTORESIST MATERIAL COMPRISING BLEND OF ALKALI-SOLUBLE NOVOLAK RESIN AND A 1,2-NAPHTHOQUINONEDIAZIDE-5-SULFONIC ESTER; FINE RESOLUTION TOKYO OHKA KOGYO CO., LTD. (JP) 2001-02-13 US disclosed
US-6177226-B1 PROVIDES A CONTACT HOLE PATTERN IMAGE HAVING LESS DIMPLES AND BEING IN EXACT ACCORDANCE WITH A MASK PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2001-01-23 US disclosed
US-6127087-A COMPOSITION COMPRISING ALKALI-SOLUBLE RESIN, SPECIFIED QUINONEDIAZIDE COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2000-10-03 US disclosed
US-6120969-A PHENOLIC RESINS FOR PHOTORESISTS TOKYO OHKA KOGYO CO., LTD. (JP) 2000-09-19 US disclosed
US-6083657-A PHENOL-FORMALDEHYDE RESIN AND QUINONEDIAZIDE COMPOUND; SEMICONDUCTORS, INTEGRATED CIRCUITS TOKYO OHKA KOGYO CO., LTD. (JP) 2000-07-04 US disclosed
US-6030741-A SOLVENT CONTAINING A MIXTURE OF HEPATANONE-2, ETHYL ACETATE AND A HIGH BOILING BENZYL SALICYLATE; RESIST PATTERN EXHIBITING PHOTOSENSITIVITY LESS VARIABLE RELATIVE TO ITS THICKNESS; SUPERIOR SHAPE-PROFILING TOKYO OHKA KOGYO CO., LTD. (JP) 2000-02-29 US disclosed
EP-0902326-A2 Novolak resin precursor, novolak resin and positive photoresist composition containing the novolak resin TOKYO OHKA KOGYO CO., LTD. (JP) 1999-03-17 EP disclosed