SCHEMBL278473

SCHEMBL278473

NCNC(=O)CC(=O)NCNC(=O)CC(=O)NCN

nearest known ligand 0.38

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
TPSAB1 Q15661 1/20 0.38
ALDH1A1 P00352 1/20 0.32
TSHR P16473 1/20 0.32
MAPK1 P28482 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
ECE1 P42892 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13904209 0.87 TPSAB1 (0.34) TPSAB1ECE1
SCHEMBL14094896 0.78 MCL1 (0.37) TPSAB1ALDH1A1
SCHEMBL24427061 0.77
SCHEMBL14678917 0.77
SCHEMBL8187940 0.75
SCHEMBL13155732 0.75
SCHEMBL13904207 0.74
SCHEMBL13155701 0.74 TPSAB1 (0.33) TPSAB1
SCHEMBL14703489 0.73 ALDH1A1 (0.33) ALDH1A1TSHRMAPK1TDP1
SCHEMBL13155696 0.72 TPSAB1 (0.32) TPSAB1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8133550-B2 Good breaking elongation characteristics, achievable high sensitivity and high film remaining rate, little in pattern size fluctuation at the heating time after lithographic process, capable of stable pattern formation; manufacturing a semiconductor device FUJIFILM CORPORATION (JP) 2012-03-13 US disclosed
US-20090056982-A1 Process for producing a double-sided flexible printed board and double-sided flexible printed board NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2009-03-05 US disclosed
US-20080076849-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed