SCHEMBL278528

SCHEMBL278528

CS(=O)(=O)c1cccc2c1C=CC(=O)C2=[N+]=[N-]

nearest known ligand 0.33

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
PTPRC P08575 1/20 0.33
BCAT2 O15382 1/20 0.32
BRD9 Q9H8M2 1/20 0.31
BAZ2B Q9UIF8 1/20 0.31
BAZ2A Q9UIF9 1/20 0.31
IDO1 P14902 1/20 0.31
MAOA P21397 1/20 0.31
MAOB P27338 1/20 0.31
CDC25B P30305 1/20 0.31
AKT1 P31749 1/20 0.31
SNCA P37840 1/20 0.31
MAP2K1 Q02750 1/20 0.31
PIN1 Q13526 1/20 0.31
EHMT2 Q96KQ7 1/20 0.31
NSD1 Q96L73 1/20 0.31
EHMT1 Q9H9B1 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8373354 0.85 PTPRC (0.33) PTPRCIDO1MAOAMAOBCDC25B
SCHEMBL13155736 0.85 PTPRC (0.31) PTPRCIDO1MAOAMAOBCDC25B
SCHEMBL7596839 0.81 HTT (0.41)
SCHEMBL5886356 0.80 PTPRC (0.49) PTPRCBCAT2BRD9BAZ2BBAZ2A
SCHEMBL818753 0.80 BRD9 (0.31) PTPRCBRD9BAZ2BBAZ2A
SCHEMBL14179209 0.78 CA1 (0.35) PTPRCIDO1MAOAMAOBCDC25B
SCHEMBL278744 0.73 PTPN1 (0.41) PTPRCIDO1MAOAMAOBCDC25B
SCHEMBL14488751 0.71 BAZ2B (0.36) PTPRCBCAT2BRD9BAZ2BBAZ2A
SCHEMBL819288 0.71 BAZ2B (0.33) PTPRCBCAT2BRD9BAZ2BBAZ2A
SCHEMBL13930823 0.70 BAZ2B (0.35) BCAT2BRD9BAZ2BBAZ2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8530003-B2 Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device FUJIFILM CORPORATION (JP) 2013-09-10 US disclosed
US-20120115333-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2012-05-10 US disclosed
US-8173349-B2 Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device FUJIFILM CORPORATION (JP) 2012-05-08 US disclosed
US-20120088189-A1 CONDUCTIVE COMPOSITION, TRANSPARENT CONDUCTIVE FILM, DISPLAY ELEMENT AND INTEGRATED SOLAR BATTERY FUJIFILM CORPORATION (JP) 2012-04-12 US disclosed
US-8133550-B2 Good breaking elongation characteristics, achievable high sensitivity and high film remaining rate, little in pattern size fluctuation at the heating time after lithographic process, capable of stable pattern formation; manufacturing a semiconductor device FUJIFILM CORPORATION (JP) 2012-03-13 US disclosed
US-7803510-B2 Positive photosensitive polybenzoxazole precursor compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2010-09-28 US disclosed
US-20100080963-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-7615324-B2 Photosensitive composition, and cured relief pattern production method and semiconductor device using the same FUJIFILM CORPORATION (JP) 2009-11-10 US disclosed
US-7615331-B2 Photosensitive resin composition, production method of cured relief pattern using the same and semiconductor device FUJIFILM CORPORATION (JP) 2009-11-10 US disclosed
US-7598009-B2 Photosensitive resin composition, production method for cured relief pattern using it, and semiconductor device FUJIFILM CORPORATION (JP) 2009-10-06 US disclosed
US-7371501-B2 Photosensitive resin composition and method for manufacturing semiconductor apparatus using the same FUJIFILM CORPORATION (JP) 2008-05-13 US disclosed
US-20080081294-A1 PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF CURED RELIEF PATTERN USING THE SAME AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2008-04-03 US disclosed
US-20080076849-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-7348122-B2 Photosensitive resin composition and method for manufacturing semiconductor device using the same FUJIFILM CORPORATION (JP) 2008-03-25 US disclosed
US-20070254243-A1 METHOD FOR MANUFACTURING PHOTOSENSITIVE RESIN COMPOSITION AND RELIEF PATTERN USING THE SAME FUJIFILM CORPORATION (JP) 2007-11-01 US disclosed
US-20070212899-A1 Photosensitive resin composition and method for manufacturing semiconductor apparatus using the same FUJIFILM CORPORATION (JP) 2007-09-13 US disclosed
US-7220520-B2 Photosensitive resin compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2007-05-22 US disclosed
US-20070099111-A1 Novel positive photosensitive polybenzoxazole precursor compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2007-05-03 US disclosed
US-7195849-B2 Photosensitive resin compositions ARCH SPECIALTY CHEMICALS, INC. (US) 2007-03-27 US disclosed
US-20070048656-A1 Photosensitive resin composition and method for manufacturing semiconductor device using the same FUJI PHOTO FILM CO., LTD. 2007-03-01 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20120115333-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE CD79B, BRIX1, SMARCB1 PTPRC 3436/4885BCAT2 1506/4885BRD9 604/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.