Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | BRD9 | Q9H8M2 | 1/20 | 0.31 |
| ▸ | BAZ2B | Q9UIF8 | 1/20 | 0.31 |
| ▸ | BAZ2A | Q9UIF9 | 1/20 | 0.31 |
| ▸ | PTPRC | P08575 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.30 |
| ▸ | HSD11B1 | P28845 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7645795 | 0.86 | — | — | |
| SCHEMBL25780834 | 0.85 | ADRA2A (0.31) | PTPRC | |
| SCHEMBL15624676 | 0.85 | ALOX15 (0.31) | PTPRC | |
| SCHEMBL823909 | 0.84 | — | — | |
| SCHEMBL823887 | 0.84 | TTR (0.33) | PTPRC | |
| SCHEMBL9644548 | 0.84 | STAT3 (0.41) | — | |
| SCHEMBL8608275 | 0.84 | TTR (0.33) | PTPRC | |
| SCHEMBL823904 | 0.84 | PTPRC (0.35) | PTPRC | |
| Hydrochloric Acid SCHEMBL7749007 | 0.83 | TTR (0.33) | PTPRC | |
| SCHEMBL7103287 | 0.83 | PKLR (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 226 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| US-11822242-B2 | DNQ-type photoresist composition including alkali-soluble acrylic resins | MERCK PATENT GMBH (DE) | 2023-11-21 | — | — | US | disclosed |
| US-20230369271-A1 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE | TORAY INDUSTRIES, INC. (JP) | 2023-11-16 | — | — | US | disclosed |
| US-11802181-B2 | Di-amine compound, and heat-resistant resin and resin composition using the same | TORAY INDUSTRIES, INC. (JP) | 2023-10-31 | — | — | US | disclosed |
| US-20230335697-A1 | DISPLAY DEVICE AND PRODUCTION METHOD FOR DISPLAY DEVICE | TORAY INDUSTRIES, INC. (JP) | 2023-10-19 | — | — | US | disclosed |
| US-20230314942-A1 | POLYCYCLIC POLYPHENOLIC RESIN, COMPOSITION, METHOD FOR PRODUCING POLYCYCLIC POLYPHENOLIC RESIN, COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, RADIATION-SENSITIVE COMPOSITION, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, AND COMPOSITION FOR OPTICAL MEMBER FORMATION | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-10-05 | — | — | US | disclosed |
| US-11768434-B2 | Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-09-26 | — | — | US | disclosed |
| US-11762290-B2 | Photoresist composition, method for preparing the same, and patterning method | Beijing Asahi Electronic Materials Co., Ltd (CN) | 2023-09-19 | — | — | US | disclosed |
| US-11675266-B2 | Photosensitive compound, photosensitive composition, and patterning method | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) | 2023-06-13 | — | — | US | disclosed |
| US-11650499-B2 | Photosensitive resin composition, organic EL element barrier rib, and organic EL element | SHOWA DENKO K.K. (JP) | 2023-05-16 | — | — | US | disclosed |
| US-20070254221-A1 | Akali-soluble resin, quinone diazide, surfactant mixture of a 3-perfluoroalkylpropane epoxide and polyethersilicones), and a solvent; high-quality display panels with uniformly-coated insulating layers. | SAMSUNG DISPLAY CO., LTD. (KR) | 2007-11-01 | — | — | US | disclosed |
| US-20070218398-A1 | Photosensitive silane coupling agent, method of modifying surface, method of forming pattern, and method of fabricating device | CANON KABUSHIKI KAISHA (JP) | 2007-09-20 | — | — | US | disclosed |
| US-7256419-B2 | Composition for forming organic insulating film and organic insulating film formed from the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-08-14 | — | — | US | disclosed |
| US-7238455-B2 | Mixture of alkali soluble resin, quinonediazide compound and alcohol | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2007-07-03 | — | — | US | disclosed |
| US-7229747-B2 | Surface treatment of interpenetrating polymer networkcarbon tubes; photolithography; heat curing; negative patterns | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-06-12 | — | — | US | disclosed |
| US-20070122733-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| US-7220520-B2 | Photosensitive resin compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2007-05-22 | — | — | US | disclosed |
| US-7214455-B2 | Photosensitive resin composition and process for producing heat-resistant resin film | TORAY INDUSTRIES, INC. (JP) | 2007-05-08 | — | — | US | disclosed |
| US-20070099111-A1 | Novel positive photosensitive polybenzoxazole precursor compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2007-05-03 | — | — | US | disclosed |
| US-7195849-B2 | Photosensitive resin compositions | ARCH SPECIALTY CHEMICALS, INC. (US) | 2007-03-27 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-11675266-B2 | Photosensitive compound, photosensitive composition, and patterning method | LCP1, RARG, DSG1 | BRD9 60/4885BAZ2B 1527/4885BAZ2A 1205/4885 |
| US-11802181-B2 | Di-amine compound, and heat-resistant resin and resin composition using the same | CAD, ARID2, SMC3 | BRD9 264/4885BAZ2B 292/4885BAZ2A 307/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.