⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6521974 | 0.78 | — | — | |
| SCHEMBL6520497 | 0.78 | — | — | |
| SCHEMBL3699141 | 0.67 | — | — | |
| SCHEMBL2774893 | 0.67 | ALDH1A1 (0.33) | — | |
| SCHEMBL11684323 | 0.67 | — | — | |
| SCHEMBL262557 | 0.67 | — | — | |
| Chloromethane SCHEMBL28462365 | 0.64 | — | — | |
| SCHEMBL10531283 | 0.64 | — | — | |
| SCHEMBL103428 | 0.64 | — | — | |
| SCHEMBL3153701 | 0.64 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7767488-B2 | Method for forming a stacked structure of an insulating layer and an organic semiconductor layer, organic field effect transistor and method for making same | SONY CORPORATION (JP) | 2010-08-03 | — | — | US | claimed |
| US-20060289859-A1 | METHOD FOR FORMING A STACKED STRUCTURE OF AN INSULATING LAYER AND AN ORGANIC SEMICONDUCTOR LAYER, ORGANIC FIELD EFFECT TRANSISTOR AND METHOD FOR MAKING SAME | SONY CORPORATION (JP) | 2006-12-28 | — | — | US | claimed |
| CN-111825710-B | Alkoxysilyl group-containing organosilane compound, method for producing same, composition containing same, and cured product | 信越化学工业株式会社 | 2024-08-23 | — | — | CN | disclosed |
| US-11708460-B2 | Alkoxysilyl group-containing organic silazane compound, method for producing same, composition containing same and cured product | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-07-25 | — | — | US | disclosed |
| US-11292890-B2 | Curable resin composition and sealing material using same | NIPPON SHOKUBAI CO., LTD. (JP) | 2022-04-05 | — | — | US | disclosed |
| EP-3260501-B1 | CURABLE RESIN COMPOSITION AND SEALING MATERIAL USING SAME | NIPPON CATALYTIC CHEM IND (JP) | 2021-01-27 | — | — | EP | disclosed |
| CN-111825710-A | Organosilazane compounds containing alkoxysilyl groups, process for their preparation, compositions containing them and cured products | 信越化学工业株式会社 | 2020-10-27 | — | — | CN | disclosed |
| US-20200332071-A1 | ALKOXYSILYL GROUP-CONTAINING ORGANIC SILAZANE COMPOUND, METHOD FOR PRODUCING SAME, COMPOSITION CONTAINING SAME AND CURED PRODUCT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-10-22 | — | — | US | disclosed |
| EP-3725822-A1 | ALKOXYSILYL GROUP-CONTAINING ORGANIC SILAZANE COMPOUND, METHOD FOR PRODUCING SAME, COMPOSITION CONTAINING SAME AND CURED PRODUCT | Shin-Etsu Chemical Co., Ltd. (JP) | 2020-10-21 | — | — | EP | disclosed |
| US-20200172703-A1 | CURABLE RESIN COMPOSITION AND SEALING MATERIAL USING SAME | NIPPON CATALYTIC CHEM IND (JP) | 2020-06-04 | — | — | US | disclosed |
| US-10597517-B2 | Curable resin composition and sealing material using same | NIPPON SHOKUBAI CO., LTD. (JP) | 2020-03-24 | — | — | US | disclosed |
| EP-1470928-A1 | COATING COMPOSITION FOR INK-JET RECORDING MEDIUM AND INK-JET RECORDING MEDIUM | Clariant International Ltd. (CH) | 2004-10-27 | — | — | EP | disclosed |
| US-6803445-B2 | Moisture curable polyurethane and/or epoxy resin composition and storage stabilizer contained therein | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2004-10-12 | — | — | US | disclosed |
| US-20030130411-A1 | Moisture curable polyurethane and/or epoxy resin composition and storage stabilizer contained therein | YOKOHAMA RUBBER CO., LTD., THE (JP) | 2003-07-10 | — | — | US | disclosed |
| EP-1114734-A1 | RESIN COMPOSITION FOR INK-JET RECORDING SHEET AND RECORDING SHEET MADE WITH THE SAME | DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) | 2001-07-11 | — | — | EP | disclosed |
| EP-0989162-A1 | THERMOPLASTIC RESIN COMPOSITION, WATER-BASED COMPOSITION, HEAT-SENSITIVE PRESSURE-SENSITIVE ADHESIVE, AND HEAT-SENSITIVE SHEET | Daicel Chemical Industries, Ltd. (JP) | 2000-03-29 | — | — | EP | disclosed |
| EP-0989168-A1 | Water-based coating composition | Daicel Chemical Industries, Ltd. (JP) | 2000-03-29 | — | — | EP | disclosed |
| EP-0542617-B1 | Method for the preparation of an oximesilane compound | SHINETSU CHEMICAL CO (JP) | 1997-08-13 | — | — | EP | disclosed |
| US-5241095-A | METHOD FOR THE PREPARATION OF AN OXIMESILANE COMPOUND | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1993-08-31 | — | — | US | disclosed |
| EP-0542617-A1 | Method for the preparation of an oximesilane compound | Shin-Etsu Chemical Co., Ltd. (JP) | 1993-05-19 | — | — | EP | disclosed |