Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL384355 | 1.00 | TSHR (0.33) | TSHREPHX1 | |
| SCHEMBL12394593 | 0.98 | TSHR (0.34) | TSHREPHX1 | |
| SCHEMBL10071386 | 0.92 | TSHR (0.31) | TSHR | |
| SCHEMBL10071385 | 0.92 | TSHR (0.31) | TSHR | |
| SCHEMBL10071382 | 0.92 | TSHR (0.31) | TSHR | |
| SCHEMBL21396944 | 0.91 | TSHR (0.32) | TSHR | |
| SCHEMBL17133610 | 0.90 | EPHX1 (0.39) | TSHREPHX1 | |
| SCHEMBL439901 | 0.88 | TSHR (0.36) | TSHREPHX1 | |
| SCHEMBL28041974 | 0.88 | TSHR (0.31) | TSHR | |
| SCHEMBL10071384 | 0.87 | TSHR (0.32) | TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-105549324-A | Photo-setting and thermosetting resin composition and dry film type solder resist | LG CHEMICAL LTD | 2016-05-04 | — | — | CN | disclosed |
| CN-103460132-B | Photosensitive composite, its cured film and employ their printed circuit board (PCB) | TAIYO INK MFG. Co.,Ltd. (JP) | 2016-04-27 | — | — | CN | disclosed |
| CN-103492950-B | Photocurable and thermosetting resin composition | TAIYO INK MFG. Co.,Ltd. (JP) | 2016-04-13 | — | — | CN | disclosed |
| CN-105467752-A | Photocurable and thermosetting resin composition and dry film for manufacturing printed circuit board, cured product, and printed circuit board | TAIYO INK (SUZHOU) CO LTD | 2016-04-06 | — | — | CN | disclosed |
| CN-105467753-A | Photocurable and thermosetting resin composition, dry film, cured product, and printed circuit board | TAIYO INK (SUZHOU) CO LTD | 2016-04-06 | — | — | CN | disclosed |
| CN-105467762-A | Curing resin composition, dried film and cured material thereof, and printed circuit board with same | SANYO ELECTRIC CO | 2016-04-06 | — | — | CN | disclosed |
| CN-105446078-A | A photocuring thermocuring resin composition for hole filling, a cured substance and a printed circuit board | TAIYO INK (SUZHOU) CO LTD | 2016-03-30 | — | — | CN | disclosed |
| CN-105425539-A | Black photocurable and thermosetting resin composition, cured product, and printed circuit board | TAIYO INK (SUZHOU) CO LTD | 2016-03-23 | — | — | CN | disclosed |
| CN-103365082-B | Flame-retardant curable resin composition, dry film, anti-flammability overlay film and printed circuit board (PCB) | TAIYO INK MANUFACTURING CO., LTD. (JP) | 2016-02-10 | — | — | CN | disclosed |
| CN-103339537-B | Light-shielding composition, method for producing same, solder resist, and method for forming pattern | FUJIFILM CORP. (JP) | 2016-02-03 | — | — | CN | disclosed |
| CN-104950573-A | Photocuring and thermosetting resin composition, dry film, cured product and printed circuit board | TAIYO INK SUZHOU CO LTD | 2015-09-30 | — | — | CN | disclosed |
| CN-104854486-A | Curable resin composition, and image-sensor-chip production method and image sensor chip using same | FUJIFILM CORP | 2015-08-19 | — | — | CN | disclosed |
| CN-104823083-A | Curable resin composition, and image-sensor-chip production method and image sensor chip using same | FUJIFILM CORP | 2015-08-05 | — | — | CN | disclosed |
| CN-104678701-A | PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED CIRCUIT BOARD | TAIYO INK MFG CO LTD | 2015-06-03 | — | — | CN | disclosed |
| CN-104516204-A | Curable composition for printed circuit board, cured coating film using the same, and printed circuit board | TAIYO INK MFG CO LTD | 2015-04-15 | — | — | CN | disclosed |
| CN-104516203-A | White curable composition for printed circuit board, cured coating film using the same, and printed circuit board | TAIYO INK MFG CO LTD | 2015-04-15 | — | — | CN | disclosed |
| CN-102804066-B | Photo-curing and thermosetting resin composition and dry film solder resist | LG CHEMICAL LTD | 2015-04-01 | — | — | CN | disclosed |
| CN-104423152-A | PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD | TAIYO INK MFG CO LTD | 2015-03-18 | — | — | CN | disclosed |
| CN-104423160-A | Photosensitive Resin Composition, Dry Film, Cured Material And Printed Circuit Board | TAIYO INK MFG CO LTD | 2015-03-18 | — | — | CN | disclosed |
| CN-104380197-A | Alkaline-developable thermosetting resin composition and printed circuit board | TAIYO INK MFG CO LTD | 2015-02-25 | — | — | CN | disclosed |