Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 2/20 | 0.61 |
| ▸ | GSK3A | P49840 | 2/20 | 0.48 |
| ▸ | GSK3B | P49841 | 2/20 | 0.48 |
| ▸ | CCR6 | P51684 | 1/20 | 0.48 |
| ▸ | ELANE | P08246 | 3/20 | 0.40 |
| ▸ | MGLL | Q99685 | 4/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.39 |
| ▸ | LMNA | P02545 | 2/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.38 |
| ▸ | NPC1 | O15118 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 1/20 | 0.38 |
| ▸ | RAB9A | P51151 | 1/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.38 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.38 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.38 |
| ▸ | MMP2 | P08253 | 2/20 | 0.38 |
| ▸ | MMP9 | P14780 | 2/20 | 0.38 |
| ▸ | MMP8 | P22894 | 2/20 | 0.38 |
| ▸ | MMP13 | P45452 | 2/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Diphenylmethane SCHEMBL7026541 | 0.82 | CALM1 (0.57) | GSK3AGSK3BCCR6ELANEMGLL | |
| Diphenylmethane SCHEMBL25292606 | 0.82 | CALM1 (0.57) | GSK3AGSK3BCCR6ELANEMGLL | |
| Benzyl Bromide SCHEMBL28853884 | 0.78 | TRPA1 (0.61) | GSK3AGSK3BCCR6ELANEMGLL | |
| Ethylbenzene SCHEMBL1331299 | 0.78 | — | — | |
| Ethylbenzene SCHEMBL7458207 | 0.78 | TP53 (1.00) | TP53ALDH1A1MAPTRAB9ASMN1; SMN2 | |
| Ethylbenzene SCHEMBL1330604 | 0.78 | — | — | |
| Ethylbenzene SCHEMBL3987542 | 0.78 | TP53 (1.00) | TP53ALDH1A1MAPTRAB9ASMN1; SMN2 | |
| Ethylbenzene SCHEMBL11223212 | 0.78 | TP53 (1.00) | TP53ALDH1A1MAPTRAB9ASMN1; SMN2 | |
| Ethylbenzene SCHEMBL1332452 | 0.78 | — | — | |
| Ethylbenzene SCHEMBL27395806 | 0.78 | TP53 (1.00) | TP53ALDH1A1MAPTRAB9ASMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-104744873-A | Low/high-heat-resistant ABS resin and preparation method thereof | Nanjing jinshan automobile engineering plastic co ltd | 2015-07-01 | — | — | CN | claimed |
| CN-114075335-B | Polyphenyl ether resin, resin composition containing polyphenyl ether resin and product | 台光电子材料(昆山)有限公司 | 2023-03-07 | — | — | CN | disclosed |
| CN-110511566-A | Thermosetting resin composition, method for producing same, prepreg, laminate, and printed wiring board | HITACHI CHEMICAL CO LTD | 2019-11-29 | — | — | CN | disclosed |
| CN-110506066-A | Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board | MITSUBISHI GAS CHEMICAL CO | 2019-11-26 | — | — | CN | disclosed |
| CN-110402269-A | Resin composition and resin sheet | LINTEC CORP | 2019-11-01 | — | — | CN | disclosed |
| CN-110300493-A | Dry film, solidfied material and electronic component | 太阳油墨制造株式会社 | 2019-10-01 | — | — | CN | disclosed |
| CN-110218415-A | Resin combination, prepreg, laminate, metal-clad laminate and printed wiring board | 广东生益科技股份有限公司 | 2019-09-10 | — | — | CN | disclosed |
| CN-110050514-A | The manufacturing method of dry film, solidfied material, printed circuit board and solidfied material | 太阳油墨制造株式会社 | 2019-07-23 | — | — | CN | disclosed |
| CN-110036472-A | Method for manufacturing semiconductor device | 日立化成株式会社 | 2019-07-19 | — | — | CN | disclosed |
| CN-110003457-A | The manufacturing method of carbonate resin, its manufacturing method, resin varnish and plywood containing allyl | 群荣化学工业株式会社 | 2019-07-12 | — | — | CN | disclosed |
| CN-107207855-A | Resin composition for printed circuit board, prepreg, resin compounded piece and clad with metal foil plywood | 三菱瓦斯化学株式会社 | 2017-09-26 | — | — | CN | disclosed |
| CN-107207837-A | Hot curing resin composition, dry film, solidfied material and printed circuit board (PCB) | 太阳油墨制造株式会社 | 2017-09-26 | — | — | CN | disclosed |
| CN-107075090-A | Cyanate esters and its manufacture method, resin combination and solidfied material | 三菱瓦斯化学株式会社 | 2017-08-18 | — | — | CN | disclosed |
| CN-105308118-B | Resin composition, prepreg, resin sheet, and metal foil-clad laminate | 三菱瓦斯化学株式会社 | 2017-08-08 | — | — | CN | disclosed |
| CN-107001767-A | Resin combination, prepreg, clad with metal foil plywood, resin compounded piece and printed circuit board (PCB) | 三菱瓦斯化学株式会社 | 2017-08-01 | — | — | CN | disclosed |
| CN-103328549-B | Prepreg, and laminate and printed wiring board using same | 日立化成株式会社 | 2017-05-03 | — | — | CN | disclosed |
| CN-104170532-B | Manufacturing method for laminated board and printed wiring board | 住友电木株式会社 | 2017-02-22 | — | — | CN | disclosed |
| CN-106416437-A | Printed circuit board resin laminate for forming fine via hole, and multilayer printed circuit board having fine via hole in resin insulating layer and method for manufacturing same | 三菱瓦斯化学株式会社 | 2017-02-15 | — | — | CN | disclosed |
| CN-105960427-A | Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2016-09-21 | — | — | CN | disclosed |
| CN-104744873-A | Low/high-heat-resistant ABS resin and preparation method thereof | Nanjing jinshan automobile engineering plastic co ltd | 2015-07-01 | — | — | CN | disclosed |