SCHEMBL28020733

SCHEMBL28020733

C=CC(=O)OCCc1cccc2c1C(=O)N(C)C2=O

nearest known ligand 0.51

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TYMS P04818 2/20 0.46
HPGD P15428 2/20 0.42
MAPT P10636 1/20 0.42
THRB P10828 1/20 0.42
ALDH1A1 P00352 4/20 0.40
KDM4E B2RXH2 2/20 0.40
MEN1 O00255 1/20 0.40
USP2 O75604 1/20 0.40
CASP1 P29466 1/20 0.40
BRCA1 P38398 1/20 0.40
CASP7 P55210 1/20 0.40
KMT2A Q03164 1/20 0.40
GAA P10253 1/20 0.39
PORCN Q9H237 1/20 0.38
TP53 P04637 2/20 0.37
TSHR P16473 2/20 0.37
HIF1A Q16665 2/20 0.37
HSD17B10 Q99714 1/20 0.37
TRPA1 O75762 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12097976 0.80 THRB (0.43) TYMSHPGDTHRBALDH1A1KDM4E
SCHEMBL28797457 0.73 HPGD (0.47) TYMSHPGDMAPTALDH1A1KDM4E
SCHEMBL20449043 0.72 THRB (0.56) THRBALDH1A1KMT2ATP53TSHR
SCHEMBL28200011 0.72 THRB (0.49) HPGDTHRBALDH1A1GAATP53
SCHEMBL13671328 0.71 MEN1 (0.60) TYMSHPGDMAPTALDH1A1KDM4E
SCHEMBL29745732 0.71 THRB (0.55) HPGDTHRBALDH1A1KDM4EKMT2A
SCHEMBL148311 0.71 THRB (0.55) HPGDTHRBALDH1A1KDM4EKMT2A
SCHEMBL27748616 0.71 THRB (0.55) HPGDTHRBALDH1A1TP53TSHR
SCHEMBL4543868 0.71 KDM4E (0.53) TYMSHPGDMAPTALDH1A1KDM4E
SCHEMBL15748154 0.71 THRB (0.40) HPGDTHRBALDH1A1KDM4EMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106133894-A Hot curing resin composition, semiconductor device and electrical and electronic parts 京瓷株式会社 2016-11-16 CN disclosed
CN-102618213-B Resin composition and semiconductor devices made by using the same SUMITOMO BAKELITE CO 2015-05-20 CN disclosed