⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17145901 | 0.88 | ALDH1A1 (0.56) | — | |
| SCHEMBL17145900 | 0.84 | CA1 (0.41) | — | |
| SCHEMBL21195145 | 0.82 | — | — | |
| SCHEMBL237213 | 0.81 | — | — | |
| SCHEMBL309582 | 0.78 | — | — | |
| SCHEMBL308930 | 0.77 | — | — | |
| SCHEMBL4847963 | 0.77 | — | — | |
| SCHEMBL133776 | 0.77 | — | — | |
| SCHEMBL11320949 | 0.75 | TSHR (0.56) | — | |
| SCHEMBL7713475 | 0.73 | ADH1B (0.37) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115702270-B | Fiber bundling agent, fiber material, molding material, and molded article | DIC株式会社 | 2025-04-04 | — | — | CN | disclosed |
| CN-119053634-A | Aqueous urethane resin composition | DIC株式会社 | 2024-11-29 | — | — | CN | disclosed |
| CN-108350307-B | The manufacturing method of metal surface treating composition, metal material | 日本帕卡濑精株式会社 | 2019-11-05 | — | — | CN | disclosed |
| CN-109790372-A | Aqueous resin composition, smears and article | DIC株式会社 | 2019-05-21 | — | — | CN | disclosed |
| CN-108866523-A | Water-based metal-surface-treating agent and the tunicate metal material of tool and its manufacturing method | 日本帕卡濑精株式会社 | 2018-11-23 | — | — | CN | disclosed |
| CN-108864920-A | Water-based metal-surface-treating agent and metal material and its manufacturing method with ground process layer | 日本帕卡濑精株式会社 | 2018-11-23 | — | — | CN | disclosed |
| CN-108864919-A | Complex, aqueous resin composition and coating | 日本帕卡濑精株式会社 | 2018-11-23 | — | — | CN | disclosed |
| CN-108350307-A | The manufacturing method of metal surface treating composition, metal material | 日本帕卡濑精株式会社 | 2018-07-31 | — | — | CN | disclosed |
| CN-105144853-A | Method for forming conductive high-definition pattern, and circuit | DAINIPPON INK & CHEMICALS | 2015-12-09 | — | — | CN | disclosed |
| CN-103201117-B | Resin composition for forming receiving layer, and receiving substrate, printed matter, conductive pattern and circuit obtained using same | DIC CORP. (JP) | 2015-08-19 | — | — | CN | disclosed |