SCHEMBL28032433

SCHEMBL28032433

C=C(C)C(=O)NC(C)(C)C(C)(C)N

nearest known ligand 0.38

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.38
ALDH1A1 P00352 2/20 0.33
TGFBR1 P36897 1/20 0.32
KDM4E B2RXH2 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL5871680 0.98 TDP1 (0.36) TDP1ALDH1A1TGFBR1KDM4E
SCHEMBL7709808 0.83 TDP1 (0.39) TDP1ALDH1A1TGFBR1KDM4E
Hydrochloric Acid SCHEMBL11184246 0.81 TDP1 (0.38) TDP1ALDH1A1TGFBR1KDM4E
SCHEMBL11139937 0.79 TGFBR1 (0.32) TDP1TGFBR1
Hydrochloric Acid SCHEMBL5194198 0.77 TDP1 (0.35) TDP1ALDH1A1TGFBR1
SCHEMBL138082 0.77 EPHX1 (0.41) TDP1ALDH1A1TGFBR1KDM4E
SCHEMBL28937708 0.76 TGFBR1 (0.33) ALDH1A1TGFBR1
SCHEMBL27482325 0.76 TGFBR1 (0.33) TDP1ALDH1A1TGFBR1
SCHEMBL9682306 0.76 RXFP1 (0.34) TDP1ALDH1A1TGFBR1
SCHEMBL822811 0.75 ALDH1A1 (0.36) TDP1ALDH1A1TGFBR1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108713242-A The grinding method and composition for polishing set group of silicon substrate 福吉米株式会社 2018-10-26 CN disclosed
CN-104995277-B Composition for polishing, composition for polishing manufacture method and abrasive material manufacture method 福吉米株式会社 2018-05-08 CN disclosed
CN-105073941-B Composition for polishing and abrasive material manufacture method 福吉米株式会社 2018-01-30 CN disclosed
CN-105264647-B Silicon Wafer composition for polishing 福吉米株式会社 2018-01-09 CN disclosed
CN-106463386-A Method for polishing silicon wafer, polishing composition, and polishing composition set 福吉米株式会社 2017-02-22 CN disclosed
CN-105264647-A Composition for silicon wafer polishing FUJIMI INC 2016-01-20 CN disclosed
CN-105073941-A Polishing composition and method for manufacturing polished article FUJIMI INC 2015-11-18 CN disclosed
CN-104995277-A POLISHING COMPOSITION, PRODUCTION METHOD FOR POLISHING COMPOSITION, AND PRODUCTION METHOD FOR POLISHED ARTICLE FUJIMI INC 2015-10-21 CN disclosed