SCHEMBL2805172

SCHEMBL2805172

CCCO[SiH](OCCC)OCCC.[H+]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27814 0.96 CA1 (0.30)
SCHEMBL1706451 0.93
Bromide SCHEMBL9709407 0.93
Fluoride SCHEMBL27875582 0.93
Methylamine SCHEMBL28883046 0.90 CA1 (0.33)
SCHEMBL2114831 0.87
Trimethylammonium SCHEMBL28358218 0.87
SCHEMBL930258 0.87
SCHEMBL15414776 0.84 ADRB2 (0.41)
Butane SCHEMBL3380761 0.84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110669067-B Process for preparing alkylalkoxysilanes 赢创运营有限公司 2024-06-04 CN claimed
CN-117946152-A Comprehensive utilization method of tetrafluoropropanol byproducts 中昊晨光化工研究院有限公司 2024-04-30 CN claimed
EP-3590946-B1 METHOD FOR THE PREPARATION OF ALKYLALKOXYSILANES EVONIK OPERATIONS GMBH (DE) 2021-09-22 EP claimed
CN-110669067-A Process for preparing alkylalkoxysilanes 赢创德固赛有限公司 2020-01-10 CN claimed
CN-110669067-B Process for preparing alkylalkoxysilanes 赢创运营有限公司 2024-06-04 CN disclosed
CN-117946152-A Comprehensive utilization method of tetrafluoropropanol byproducts 中昊晨光化工研究院有限公司 2024-04-30 CN disclosed
EP-3590946-B1 METHOD FOR THE PREPARATION OF ALKYLALKOXYSILANES EVONIK OPERATIONS GMBH (DE) 2021-09-22 EP disclosed
CN-110669067-A Process for preparing alkylalkoxysilanes 赢创德固赛有限公司 2020-01-10 CN disclosed
US-8440775-B2 Curable liquid composition, method of coating, inorganic substrate, and semiconductor device DOW CORNING CORPORATION (US) 2013-05-14 US disclosed
US-20100089451-A1 Curable Liquid Composition, Method Of Coating, Inorganic Substrate, and Semiconductor Device DOW CORNING TORAY COMPANY, LTD. (JP) 2010-04-15 US disclosed
EP-2118175-A2 CURABLE LIQUID COMPOSITION, METHOD OF COATING, INORGANIC SUBSTRATE, AND SEMICONDUCTOR DEVICE Dow Corning Toray Co., Ltd. (JP) 2009-11-18 EP disclosed
WO-2008099767-A2 CURABLE LIQUID COMPOSITION, METHOD OF COATING, INORGANIC SUBSTRATE, AND SEMICONDUCTOR DEVICE DOW CORNING TORAY CO., LTD. (JP) 2008-08-21 WO disclosed