⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL223336 | 0.74 | ALDH1A1 (0.31) | — | |
| SCHEMBL852183 | 0.69 | ALDH1A1 (0.35) | — | |
| SCHEMBL28003346 | 0.66 | CYP1A2 (0.34) | — | |
| SCHEMBL19462914 | 0.65 | SIGMAR1 (0.32) | — | |
| SCHEMBL3712585 | 0.63 | — | — | |
| SCHEMBL195624 | 0.63 | — | — | |
| SCHEMBL3035968 | 0.62 | GAA (0.34) | — | |
| SCHEMBL8766655 | 0.62 | GAA (0.34) | — | |
| SCHEMBL28091641 | 0.62 | GAA (0.34) | — | |
| SCHEMBL3713513 | 0.62 | GAA (0.34) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107446111-A | A kind of Silante terminated resin of amido-containing acid ester base and preparation method thereof | 万华化学集团股份有限公司 | 2017-12-08 | — | — | CN | claimed |
| CN-119775953-A | Adhesive composition, cured product, adhesive sheet, resin-coated copper foil, copper-clad laminate, and printed wiring board | 荒川化学工业株式会社 | 2025-04-08 | — | — | CN | disclosed |
| CN-110023277-A | Compound, resin, composition and corrosion-resisting pattern forming method and circuit pattern forming method | 三菱瓦斯化学株式会社 | 2019-07-16 | — | — | CN | disclosed |
| CN-110023276-A | Compound, resin, composition and corrosion-resisting pattern forming method and circuit pattern forming method | 三菱瓦斯化学株式会社 | 2019-07-16 | — | — | CN | disclosed |
| CN-109803950-A | Compound, resin and composition and corrosion-resisting pattern forming method and circuit pattern forming method | 三菱瓦斯化学株式会社 | 2019-05-24 | — | — | CN | disclosed |
| CN-109790097-A | Compound, resin, composition and corrosion-resisting pattern forming method and circuit pattern forming method | 三菱瓦斯化学株式会社 | 2019-05-21 | — | — | CN | disclosed |
| CN-109790175-A | Compound, resin, composition and corrosion-resisting pattern forming method and pattern forming method | 三菱瓦斯化学株式会社 | 2019-05-21 | — | — | CN | disclosed |
| CN-105461921-B | Polyimide resin composition, adhesive compound, paint base composition, laminated body and the copper foil with resin | 荒川化学工业株式会社 | 2019-05-10 | — | — | CN | disclosed |
| CN-107793991-A | Flexible printing wiring board copper-clad laminated board and flexible printing wiring board | 荒川化学工业株式会社 | 2018-03-13 | — | — | CN | disclosed |
| CN-106995678-A | Polyimide adhesive | 荒川化学工业株式会社 | 2017-08-01 | — | — | CN | disclosed |
| CN-106977716-A | Resin combination, adhesive, membranaceous adhesive material, sheet adhesive, the copper foil of resin, copper-clad laminated board, wiring plate | 荒川化学工业株式会社 | 2017-07-25 | — | — | CN | disclosed |
| CN-106947079-A | Modified polyimide, adhesive compound, the Copper Foil of resin, copper-clad laminated board, printed wiring board and multilager base plate | 荒川化学工业株式会社 | 2017-07-14 | — | — | CN | disclosed |
| CN-106010420-A | Polyimide-based adhesive, film adhesive, adhesive layer, adhesive sheet, copper-clad laminate, wiring board and its manufacturing method | 荒川化学工业株式会社 | 2016-10-12 | — | — | CN | disclosed |
| CN-106010421-A | Adhesive composition, film adhesive, adhesive layer, adhesive sheet, copper-clad laminate, wiring board and printing circuit board | 荒川化学工业株式会社 | 2016-10-12 | — | — | CN | disclosed |
| CN-105461921-A | Polyimide resin composition, tackifier composition, undercoat composition, laminating body, and copper foil with resin | ARAKAWA CHEM IND | 2016-04-06 | — | — | CN | disclosed |