SCHEMBL28056884

SCHEMBL28056884

NC(=O)OCCCS(=O)(=O)O.O=S(=O)(O)CCCOS(=O)(=O)CCCS.O=S(=O)(O)CCCS.[NaH]

nearest known ligand 0.33

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 1/20 0.33
PDE4A P27815 1/20 0.33
APP P05067 1/20 0.32
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL419120 0.86 PTGS1 (0.44) PTGS1PDE4AAPPLMNA
SCHEMBL28179923 0.80 APP (0.46) PTGS1PDE4AAPPLMNA
SCHEMBL28606550 0.79 PTGS1 (0.48) PTGS1PDE4AAPPLMNA
SCHEMBL28189201 0.78 PTGS1 (0.34) PTGS1PDE4A
SCHEMBL28495884 0.73 CA1 (0.35) PTGS1PDE4ALMNA
SCHEMBL20995951 0.72 PTGS1 (0.44) PTGS1PDE4AAPPLMNA
SCHEMBL28886376 0.72 PTGS1 (0.44) PTGS1PDE4AAPPLMNA
SCHEMBL11979583 0.71 APP (0.42) PTGS1PDE4AAPPLMNA
SCHEMBL29170917 0.71 APP (0.42) PTGS1PDE4AAPPLMNA
SCHEMBL18343875 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107541757-B The method of the feature limited from the copper electroplating bath liquid plating photoresist containing pyrazole compound and the reaction product of di-epoxide 罗门哈斯电子材料有限责任公司 2019-07-19 CN disclosed
CN-105732955-B The reaction product of amino acid and epoxides 罗门哈斯电子材料有限责任公司 2018-12-25 CN disclosed
CN-105732974-B Sulfamic acid based polymer for copper electroplating 罗门哈斯电子材料有限责任公司 2018-10-12 CN disclosed
CN-106435660-B The method of the feature limited from copper electroplating bath foam electroplating photoresist 罗门哈斯电子材料有限责任公司 2018-09-21 CN disclosed
CN-108026127-A Copper electroplating bath containing reaction product of amine, polyacrylamide and diepoxide 罗门哈斯电子材料有限责任公司 2018-05-11 CN disclosed
CN-107541757-A The method of the feature limited from the copper electroplating bath liquid plating photoresist containing pyrazole compound and the reaction product of di-epoxide 罗门哈斯电子材料有限责任公司 2018-01-05 CN disclosed
CN-107531899-A Reaction products of amine monomers with polymers containing saturated heterocyclic moieties as plating bath additives 罗门哈斯电子材料有限责任公司 2018-01-02 CN disclosed
CN-106435660-A Method of electroplating photoresist defined features from copper electroplating baths 罗门哈斯电子材料有限责任公司 2017-02-22 CN disclosed
CN-105732974-A AMINO SULFONIC ACID BASED POLYMERS FOR COPPER ELECTROPLATING 罗门哈斯电子材料有限责任公司 2016-07-06 CN disclosed
CN-105732542-A Sulfonamide based polymers for copper electroplating 罗门哈斯电子材料有限责任公司 2016-07-06 CN disclosed
CN-105732955-A Reaction products of amino acids and epoxies 罗门哈斯电子材料有限责任公司 2016-07-06 CN disclosed
CN-105705491-A Polymers containing benzimidazole moieties as levelers 罗门哈斯电子材料有限责任公司 2016-06-22 CN disclosed