SCHEMBL28189201

SCHEMBL28189201

O=COCCCS(=O)(=O)O.O=S(=O)(O)CCCOS(=O)(=O)CCCS.O=S(=O)(O)CCCS.[NaH]

nearest known ligand 0.34

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 1/20 0.34
PDE4A P27815 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL419120 0.87 PTGS1 (0.44) PTGS1PDE4A
SCHEMBL28606550 0.80 PTGS1 (0.48) PTGS1PDE4A
SCHEMBL3455588 0.80 APP (0.42) PTGS1PDE4A
SCHEMBL28056884 0.78 PTGS1 (0.33) PTGS1PDE4A
Formic Acid SCHEMBL14713555 0.75 APP (0.38) PTGS1PDE4A
SCHEMBL14030656 0.74 APP (0.41) PTGS1PDE4A
SCHEMBL28495884 0.74 CA1 (0.35) PTGS1PDE4A
SCHEMBL20995951 0.73 PTGS1 (0.44) PTGS1PDE4A
SCHEMBL28886376 0.73 PTGS1 (0.44) PTGS1PDE4A
SCHEMBL29170917 0.72 APP (0.42) PTGS1PDE4A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105683250-B Nitrogen-containing polymers as leveling agents 罗门哈斯电子材料有限责任公司 2019-04-12 CN disclosed
CN-108026128-A The copper electroplating bath of the compound of reaction product containing amine and quinone 罗门哈斯电子材料有限责任公司 2018-05-11 CN disclosed
CN-107531859-A As the bisgallic acid acid anhydride of plating bath additive and the reaction product of diamines 罗门哈斯电子材料有限责任公司 2018-01-02 CN disclosed