Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PTGS1 | P23219 | 1/20 | 0.44 |
| ▸ | PDE4A | P27815 | 1/20 | 0.44 |
| ▸ | APP | P05067 | 1/20 | 0.37 |
| ▸ | LMNA | P02545 | 1/20 | 0.30 |
| ▸ | SLC6A6 | P31641 | 1/20 | 0.30 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.30 |
| ▸ | BLM | P54132 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28606550 | 0.92 | PTGS1 (0.48) | PTGS1PDE4AAPPLMNASLC6A6 | |
| SCHEMBL28189201 | 0.87 | PTGS1 (0.34) | PTGS1PDE4A | |
| SCHEMBL28056884 | 0.86 | PTGS1 (0.33) | PTGS1PDE4AAPPLMNA | |
| SCHEMBL28495884 | 0.85 | CA1 (0.35) | PTGS1PDE4ALMNA | |
| SCHEMBL20995951 | 0.84 | PTGS1 (0.44) | PTGS1PDE4AAPPLMNASLC6A6 | |
| SCHEMBL28886376 | 0.84 | PTGS1 (0.44) | PTGS1PDE4AAPPLMNASLC6A6 | |
| SCHEMBL29170917 | 0.83 | APP (0.42) | PTGS1PDE4AAPPLMNASLC6A6 | |
| SCHEMBL11979583 | 0.83 | APP (0.42) | PTGS1PDE4AAPPLMNASLC6A6 | |
| SCHEMBL9859212 | 0.82 | APP (0.38) | PTGS1PDE4AAPPLMNASLC6A6 | |
| SCHEMBL28372733 | 0.81 | PTGS1 (0.50) | PTGS1PDE4AAPPLMNASLC6A6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 427 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117448899-A | Electroplating solution, electroplating process and printed circuit board | 上海天承化学有限公司 | 2024-01-26 | — | — | CN | claimed |
| CN-112725851-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-04-28 | — | — | CN | claimed |
| CN-112746292-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-04-28 | — | — | CN | claimed |
| CN-112795960-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-03-31 | — | — | CN | claimed |
| EP-2586893-B1 | COPPER PLATING BATH AND CORRESPONDING METHOD | ROHM & HAAS ELECT MAT (US) | 2022-09-21 | — | — | EP | claimed |
| EP-2855738-B1 | ADDITIVES FOR PRODUCING COPPER ELECTRODEPOSITS HAVING LOW OXYGEN CONTENT | MACDERMID ACUMEN INC (US) | 2022-07-06 | — | — | EP | claimed |
| US-11332471-B2 | Leveling agent, metal plating composition containing same, preparation method therefor and use thereof | SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD. (CN) | 2022-05-17 | — | — | US | claimed |
| CN-112795960-A | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2021-05-14 | — | — | CN | claimed |
| CN-112760683-A | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2021-05-07 | — | — | CN | claimed |
| CN-112746292-A | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2021-05-04 | — | — | CN | claimed |
| US-9869029-B2 | Composition for metal plating comprising suppressing agent for void free submicron feature filling | BASF SE (DE) | 2018-01-16 | — | — | US | claimed |
| CN-104428452-B | Additive for preparing copper electrodeposits having low oxygen content | 麦克德米德尖端有限公司 | 2017-05-17 | — | — | CN | claimed |
| US-9243339-B2 | Additives for producing copper electrodeposits having low oxygen content | CITIBANK, N.A. | 2016-01-26 | — | — | US | claimed |
| EP-2855738-A1 | ADDITIVES FOR PRODUCING COPPER ELECTRODEPOSITS HAVING LOW OXYGEN CONTENT | MacDermid Acumen, Inc. (US) | 2015-04-08 | — | — | EP | claimed |
| CN-104428452-A | Additive for preparing copper electrodeposits having low oxygen content | MACDERMID ACUMEN INC | 2015-03-18 | — | — | CN | claimed |
| US-20130313119-A1 | Additives for Producing Copper Electrodeposits Having Low Oxygen Content | CITIBANK, N.A. | 2013-11-28 | — | — | US | claimed |
| WO-2013176796-A1 | ADDITIVES FOR PRODUCING COPPER ELECTRODEPOSITS HAVING LOW OXYGEN CONTENT | MACDERMID ACUMEN,INC. (US) | 2013-11-28 | — | — | WO | claimed |
| EP-2483454-A2 | COPPER ELECTROPLATING COMPOSITION | BASF SE (DE) | 2012-08-08 | — | — | EP | claimed |
| US-20120175744-A1 | COPPER ELECTROPLATING COMPOSITION | BASF SE (DE) | 2012-07-12 | — | — | US | claimed |
| WO-2011036076-A2 | COPPER ELECTROPLATING COMPOSITION | BASF SE (DE) | 2011-03-31 | — | — | WO | claimed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-11332471-B2 | Leveling agent, metal plating composition containing same, preparation method therefor and use thereof | PRPF8, CACNA1F, ATP1B2 | PTGS1 3517/4885PDE4A 2259/4885APP 996/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.