SCHEMBL28074764

SCHEMBL28074764

Cc1ccccc1NCC(O)CO

nearest known ligand 0.60

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.60
HTT P42858 3/20 0.53
MAPT P10636 2/20 0.53
KDM4E B2RXH2 1/20 0.50
CYP1A2 P05177 1/20 0.50
MEN1 O00255 1/20 0.45
ALDH1A1 P00352 1/20 0.45
KMT2A Q03164 1/20 0.45
SMN1; SMN2 Q16637 1/20 0.43
AR P10275 1/20 0.42
VDR P11473 1/20 0.42
TSHR P16473 1/20 0.42
HSD17B10 Q99714 1/20 0.42
ADRA2C P18825 1/20 0.42
NPSR1 Q6W5P4 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10601266 0.86 MAPT (0.47) LMNAMAPTKDM4ECYP1A2ALDH1A1
SCHEMBL28614206 0.85 LMNA (0.60) LMNAHTTMAPTKDM4EMEN1
SCHEMBL17950823 0.85 LMNA (0.60) LMNAHTTMAPTMEN1ALDH1A1
SCHEMBL6259361 0.84 LMNA (0.63) LMNAHTTMAPTMEN1ALDH1A1
SCHEMBL11368501 0.84 LMNA (0.59) LMNAHTTMAPTMEN1ALDH1A1
SCHEMBL570476 0.82 HTT (0.59) LMNAHTTMAPTKDM4EMEN1
SCHEMBL17006480 0.81 HTT (0.57) LMNAHTTMAPTMEN1ALDH1A1
SCHEMBL11839093 0.79 KDM4E (0.48) LMNAMAPTKDM4EMEN1ALDH1A1
SCHEMBL6261137 0.78 LMNA (0.54) LMNAHTTMAPTKDM4EMEN1
SCHEMBL456864 0.77 MAPT (0.43) LMNAHTTMAPTKDM4EMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110382572-A Curing type aqueous resin emulsion compositions 昭和电工株式会社 2019-10-25 CN disclosed
CN-106465505-B The manufacturing method of seal 味之素株式会社 2019-09-20 CN disclosed
CN-110168016-A Liquid epoxy resin sealing material and semiconductor device 纳美仕有限公司 2019-08-23 CN disclosed
CN-102627753-B Comprise the epoxy resin of cycloalphatic diamine curing agent 陶氏环球技术有限责任公司 2017-03-01 CN disclosed
CN-103081301-B The fixing resin compositions used in rotor 住友电木株式会社 2016-10-12 CN disclosed
CN-105992779-A (meth) acrylic copolymer, adhesive composition containing same, and adhesive sheet 三菱丽阳株式会社 2016-10-05 CN disclosed
CN-105993088-A Coated negative-electrode active material for use in lithium-ion battery, slurry for use in lithium-ion battery, negative electrode for use in lithium-ion battery, lithium-ion battery, and method for manufacturing coated negative-electrode active material for use in lithium-ion battery 三洋化成工业株式会社 2016-10-05 CN disclosed
CN-105838030-A LIQUID SEALING MATERIAL AND ELECTRONIC COMPONENT USING SAME 纳美仕有限公司 2016-08-10 CN disclosed