SCHEMBL28102007

SCHEMBL28102007

CN(C)Cc1ccccc1-c1ccc(O)cc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 9/20 0.47
CYP2D6 P10635 8/20 0.47
CYP3A4 P08684 5/20 0.47
CLK4 Q9HAZ1 3/20 0.47
BACE1 P56817 1/20 0.46
ABL1 P00519 2/20 0.46
ABCB1 P08183 2/20 0.46
BCR P11274 2/20 0.46
GRM2 Q14416 1/20 0.45
ALDH1A1 P00352 6/20 0.45
CYP2C19 P33261 3/20 0.45
HSD17B10 Q99714 2/20 0.45
ITGB1 P05556 1/20 0.43
ITGA4 P13612 1/20 0.43
ITGB7 P26010 1/20 0.43
KDM4E B2RXH2 3/20 0.43
HPGD P15428 1/20 0.43
SLC6A2 P23975 1/20 0.42
SLC6A4 P31645 1/20 0.42
SLC6A3 Q01959 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3464186 0.84 DPP4 (0.54) CYP1A2CYP2D6CYP3A4CLK4BACE1
SCHEMBL6772767 0.83 SLC6A4 (0.53) CYP1A2CYP2D6CYP3A4CLK4BACE1
Hydrochloric Acid SCHEMBL6048562 0.82 DPP4 (0.52) CYP1A2CYP2D6CYP3A4CLK4BACE1
Bromide SCHEMBL27653706 0.82 DPP4 (0.52) CYP1A2CYP2D6CYP3A4CLK4BACE1
SCHEMBL3184690 0.81 CYP1A2 (0.47) CYP1A2CYP2D6CYP3A4CLK4BACE1
SCHEMBL6048522 0.81 CYP1A2 (0.50) CYP1A2CYP2D6CYP3A4CLK4BACE1
SCHEMBL8035321 0.81 SLC6A2 (0.54) CYP1A2CYP2D6CYP3A4CLK4BACE1
SCHEMBL6048563 0.81 SLC6A4 (0.54) CYP1A2CYP2D6CYP3A4CLK4BACE1
SCHEMBL6048558 0.81 BACE1 (0.48) CYP1A2CYP2D6CYP3A4CLK4BACE1
Hydrochloric Acid SCHEMBL6048561 0.80 CYP1A2 (0.49) CYP1A2CYP2D6CYP3A4CLK4BACE1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108164979-A A kind of polyurethane modified epoxy resin composition for semiconductor packages 科化新材料泰州有限公司 2018-06-15 CN claimed
CN-108117724-A It is a kind of for semiconductor-sealing-purpose can normal temperature storage type ring epoxy resin composition 科化新材料泰州有限公司 2018-06-05 CN claimed
CN-106674910-A Low-stress epoxy plastic packaging material for semiconductor packaging 科化新材料泰州有限公司 2017-05-17 CN claimed
CN-110183818-A Wafer-class encapsulation resin composition for encapsulating 味之素株式会社 2019-08-30 CN disclosed
CN-109715703-A The manufacturing method of aromatic polyether particle, the manufacturing method of resin cured matter and carbon fiber-reinforced composite material 住友化学株式会社 2019-05-03 CN disclosed
CN-109593440-A A kind of environment-friendly type nano graphene floor material and preparation method thereof 浙江润奥环保科技有限公司 2019-04-09 CN disclosed
CN-107771175-A AMIDINE CATALYST FOR CURABLE COMPOSITIONS SIKA技术股份公司 2018-03-06 CN disclosed
CN-105473634-B Flexible epoxy resin composition 味之素株式会社 2017-08-04 CN disclosed
CN-106012108-A Sizing-agent-coated carbon fibre bundle and prepreg 东丽株式会社 2016-10-12 CN disclosed