Ethylamine

Ethylamine

SCHEMBL28116250

CCN.CCNCCCN

nearest known ligand 0.61

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP2C19 P33261 3/20 0.58
CYP1A2 P05177 3/20 0.58
CA12 O43570 3/20 0.58
CA2 P00918 3/20 0.58
CA4 P22748 3/20 0.58
CA6 P23280 3/20 0.58
CA5A P35218 3/20 0.58
CA7 P43166 3/20 0.58
CA9 Q16790 3/20 0.58
CA14 Q9ULX7 3/20 0.58
CA5B Q9Y2D0 3/20 0.58
CASP2 P42575 2/20 0.58
MEN1 O00255 2/20 0.58
KMT2A Q03164 2/20 0.58
F13A1 P00488 2/20 0.58
ALOX15 P16050 2/20 0.58
THPO P40225 2/20 0.58
RECQL P46063 1/20 0.58
HSD17B10 Q99714 1/20 0.58
GLA P06280 1/20 0.58

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26485 0.97
SCHEMBL3674163 0.97 CA12 (0.61) CYP2C19CYP1A2CA12CA2CA4
SCHEMBL1536261 0.94 CA12 (0.58) CYP2C19CYP1A2CA12CA2CA4
Ammonia Solution, Strong SCHEMBL3070776 0.94
Hydrogen Sulfide SCHEMBL9231392 0.94 CYP2C19 (0.58) CYP2C19CYP1A2CA12CA2CA4
SCHEMBL10081835 0.92 CYP2C19 (0.72) CYP2C19CYP1A2CA12CA2CA4
SCHEMBL29753171 0.92 CASP2 (0.72) CYP2C19CYP1A2CA12CA2CA4
SCHEMBL12075033 0.92 CASP2 (0.72) CYP2C19CYP1A2CA12CA2CA4
SCHEMBL5386129 0.92 CYP1A2 (0.72) CYP2C19CYP1A2CA12CA2CA4
SCHEMBL29054916 0.89 CYP2C19 (0.68) CYP2C19CYP1A2CA12CA2CA4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103314651-B For obtaining the method that the palladium surface to the copper wire bonding on printed circuit board (PCB) and IC substrate is modified 安美特德国有限公司 2016-12-28 CN disclosed