Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FOLH1 | Q04609 | 13/20 | 0.64 |
| ▸ | GRM3 | Q14832 | 2/20 | 0.41 |
| ▸ | NAALAD2 | Q9Y3Q0 | 1/20 | 0.41 |
| ▸ | TET2 | Q6N021 | 3/20 | 0.39 |
| ▸ | KDM4A | O75164 | 2/20 | 0.39 |
| ▸ | KDM4C | Q9H3R0 | 2/20 | 0.39 |
| ▸ | KDM2A | Q9Y2K7 | 2/20 | 0.39 |
| ▸ | TET3 | O43151 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1900382 | 0.98 | FOLH1 (0.67) | FOLH1GRM3NAALAD2TET2KDM4A | |
| Ammonia Solution, Strong SCHEMBL2546321 | 0.95 | FOLH1 (0.64) | FOLH1GRM3NAALAD2TET2KDM4A | |
| SCHEMBL1900376 | 0.86 | FOLH1 (0.52) | FOLH1GRM3NAALAD2TET2KDM4A | |
| SCHEMBL8416810 | 0.84 | FOLH1 (0.50) | FOLH1 | |
| Ammonia Solution, Strong SCHEMBL2546314 | 0.84 | FOLH1 (0.50) | FOLH1GRM3NAALAD2TET2KDM4A | |
| SCHEMBL8419050 | 0.83 | FOLH1 (0.48) | FOLH1 | |
| SCHEMBL8415664 | 0.81 | LMNA (0.48) | FOLH1 | |
| SCHEMBL4890978 | 0.80 | FOLH1 (0.46) | FOLH1 | |
| SCHEMBL27959736 | 0.79 | FOLH1 (0.43) | FOLH1 | |
| SCHEMBL28640 | 0.78 | FOLH1 (1.00) | FOLH1GRM3NAALAD2TET2KDM4A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-106435671-A | Novel tin-cobalt alloy electroplating process | 苏州锆钒电子科技有限公司 | 2017-02-22 | — | — | CN | claimed |
| CN-106435671-A | Novel tin-cobalt alloy electroplating process | 苏州锆钒电子科技有限公司 | 2017-02-22 | — | — | CN | disclosed |