SCHEMBL2813619

SCHEMBL2813619

C1CC(SOSC2CCC2)C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1611850 0.93
SCHEMBL2813665 0.85
SCHEMBL19932987 0.65
SCHEMBL2198710 0.65
SCHEMBL545914 0.65
SCHEMBL15271208 0.62 ALDH1A1 (0.33)
SCHEMBL24961659 0.59
SCHEMBL721065 0.59
SCHEMBL721064 0.59
SCHEMBL21155623 0.59

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115094423-A Inorganic film removing liquid suitable for aluminum substrate circuit board and application thereof 深圳市板明科技股份有限公司 2022-09-23 CN claimed
CN-102532368-B Rare earth catalyst and method for polymerizing conjugated diene by using same UNIV BEIJING CHEMICAL 2014-04-02 CN claimed
CN-102532368-A Rare earth catalyst and method for polymerizing conjugated diene by using same UNIV BEIJING CHEMICAL 2012-07-04 CN claimed
CN-115094423-B Inorganic membrane removing liquid suitable for aluminum substrate circuit board and application thereof 深圳市板明科技股份有限公司 2022-11-08 CN disclosed
CN-115094423-B Inorganic membrane removing liquid suitable for aluminum substrate circuit board and application thereof 深圳市板明科技股份有限公司 2022-11-08 CN disclosed
CN-115094423-A Inorganic film removing liquid suitable for aluminum substrate circuit board and application thereof 深圳市板明科技股份有限公司 2022-09-23 CN disclosed
CN-115094423-A Inorganic film removing liquid suitable for aluminum substrate circuit board and application thereof 深圳市板明科技股份有限公司 2022-09-23 CN disclosed
CN-104220466-B For the method preparing polydiene 株式会社普利司通 2016-09-21 CN disclosed
CN-102597014-B Initiator system for cationic polymerization and polymerization method using same CHINA PETROLEUM & CHEMICAL 2015-05-13 CN disclosed
CN-104220466-A Process for producing polydienes BRIDGESTSONE CORP 2014-12-17 CN disclosed
CN-101925592-B Thietane compound, polymerizable composition containing the same, resin, method for producing resin, and use of resin MITSUI CHEMICALS INC 2014-09-03 CN disclosed
CN-102399311-B Cationic polymerization initiation system and cationic polymerization method CHINA PETROLEUM & CHEMICAL 2013-12-04 CN disclosed
CN-101910275-B Additive for polymerizable composition, polymerizable composition containing the same, and use of the polymerizable composition MITSUI CHEMICALS INC 2013-06-05 CN disclosed
CN-102597014-A Initiator system for cationic polymerization and polymerization method using same CHINA PETROLEUM & CHEMICAL 2012-07-18 CN disclosed
CN-102597011-A Iso-olefin polymer and preparation method thereof CHINA PETROLEUM & CHEMICAL 2012-07-18 CN disclosed
CN-102532368-A Rare earth catalyst and method for polymerizing conjugated diene by using same UNIV BEIJING CHEMICAL 2012-07-04 CN disclosed
CN-102399311-A Cationic polymerization initiating system and polymerization method CHINA PETROLEUM & CHEMICAL 2012-04-04 CN disclosed
CN-101925592-A Thietane compound, polymerizable composition containing the same, resin, method for producing resin, and use of resin MITSUI CHEMICALS INC 2010-12-22 CN disclosed
CN-101910275-A Additive for polymerizable composition, polymerizable composition containing the same, and use of the polymerizable composition MITSUI CHEMICALS INC 2010-12-08 CN disclosed
US-20100249259-A1 HARD FOAM JAPAN ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (JP) 2010-09-30 US disclosed