Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 6/20 | 0.62 |
| ▸ | FAAH | O00519 | 6/20 | 0.56 |
| ▸ | PTGS1 | P23219 | 3/20 | 0.48 |
| ▸ | PTGS2 | P35354 | 3/20 | 0.48 |
| ▸ | TRPV1 | Q8NER1 | 2/20 | 0.44 |
| ▸ | TK1 | P04183 | 1/20 | 0.40 |
| ▸ | DUSP3 | P51452 | 1/20 | 0.40 |
| ▸ | PTPN7 | P35236 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5245940 | 1.00 | MGLL (0.62) | MGLLFAAHPTGS1PTGS2TRPV1 | |
| SCHEMBL2814262 | 1.00 | MGLL (0.62) | MGLLFAAHPTGS1PTGS2TRPV1 | |
| SCHEMBL2814738 | 1.00 | MGLL (0.62) | MGLLFAAHPTGS1PTGS2TRPV1 | |
| SCHEMBL5245936 | 1.00 | MGLL (0.62) | MGLLFAAHPTGS1PTGS2TRPV1 | |
| SCHEMBL2814265 | 1.00 | MGLL (0.62) | MGLLFAAHPTGS1PTGS2TRPV1 | |
| SCHEMBL9470744 | 0.78 | MGLL (0.46) | MGLLFAAHPTGS1PTGS2TRPV1 | |
| SCHEMBL6077691 | 0.78 | FAAH (0.58) | MGLLFAAHTRPV1 | |
| SCHEMBL5738187 | 0.78 | FAAH (0.58) | MGLLFAAHTRPV1 | |
| SCHEMBL2720056 | 0.78 | FAAH (0.58) | MGLLFAAHTRPV1 | |
| SCHEMBL7999112 | 0.78 | FAAH (0.58) | MGLLFAAHTRPV1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-62238262-A | — | — | None | — | — | JP | disclosed |
| CN-119937243-A | Chemically amplified positive photosensitive resin composition, cured film, and element having cured film | 奇美实业股份有限公司 | 2025-05-06 | — | — | CN | disclosed |
| CN-119698450-A | Adhesive sheet and method for producing laminate | 积水化学工业株式会社 | 2025-03-25 | — | — | CN | disclosed |
| CN-119654386-A | Ultraviolet curable adhesive composition and method for producing laminate | 积水化学工业株式会社 | 2025-03-18 | — | — | CN | disclosed |
| CN-119630750-A | Photo-curable pressure-sensitive adhesive composition for printing, cured product, and laminate | 积水化学工业株式会社 | 2025-03-14 | — | — | CN | disclosed |
| CN-111886545-B | Photocurable/thermosetting resin composition, dry film, cured product, and printed wiring board | 太阳油墨制造株式会社 | 2024-07-05 | — | — | CN | disclosed |
| WO-2024117224-A1 | ULTRAVIOLET CURABLE ADHESIVE COMPOSITION, AND METHOD FOR PRODUCING MULTILAYER BODY | 積水化学工業株式会社 | 2024-06-06 | — | — | WO | disclosed |
| WO-2024117222-A1 | ULTRAVIOLET-CURABLE COMPOSITION FOR PRINTING AND METHOD FOR PRODUCING LAMINATE | 積水化学工業株式会社 | 2024-06-06 | — | — | WO | disclosed |
| WO-2024117229-A1 | PHOTOCURABLE ADHESIVE COMPOSITION FOR PRINTING, CURED PRODUCT, AND LAMINATE | 積水化学工業株式会社 | 2024-06-06 | — | — | WO | disclosed |
| WO-2024117230-A1 | PHOTOCURABLE RESIN COMPOSITION, ADHESIVE SHEET, AND METHOD FOR MANUFACTURING LAMINATE | 積水化学工業株式会社 | 2024-06-06 | — | — | WO | disclosed |
| CN-117099486-A | Laminated curable resin structure, dry film, cured product, and electronic component | 太阳油墨制造株式会社 | 2023-11-21 | — | — | CN | disclosed |
| WO-2022211120-A1 | LAMINATED CURABLE RESIN STRUCTURE, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT | 太陽インキ製造株式会社 | 2022-10-06 | — | — | WO | disclosed |
| CN-113614169-A | Curable resin composition, dry film, cured product, and electronic component | 太阳油墨制造株式会社 | 2021-11-05 | — | — | CN | disclosed |
| CN-111886545-A | Photocurable/thermosetting resin composition, dry film, cured product, and printed wiring board | 太阳油墨制造株式会社 | 2020-11-03 | — | — | CN | disclosed |
| WO-2020202690-A1 | CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT | 太陽インキ製造株式会社 | 2020-10-08 | — | — | WO | disclosed |
| WO-2019188376-A1 | PHOTOCURABLE THERMOSETTING RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD | 太陽インキ製造株式会社 | 2019-10-03 | — | — | WO | disclosed |
| US-8722816-B2 | Solder resist, dry film thereof, cured product, and printed wiring board | NIPPON SHOKUBAI CO., LTD. (JP) | 2014-05-13 | — | — | US | disclosed |
| US-20100243304-A1 | SOLDER RESIST, DRY FILM THEREOF, CURED PRODUCT, AND PRINTED WIRING BOARD | TAIYO HOLDINGS CO., LTD. (JP) | 2010-09-30 | — | — | US | disclosed |
| US-20070112106-A1 | Photosensitive resin composition | NIPPON SHOKUBAI CO., LTD. (JP) | 2007-05-17 | — | — | US | disclosed |
| JP-S62238262-A | PURIFICATION OF MALEIMIDE | NIPPON SHOKUBAI KAGAKU KOGYO CO LTD | 1987-10-19 | — | — | JP | disclosed |