SCHEMBL28154641

SCHEMBL28154641

CCCC(Nc1ccccc1)O[Si](OOC)(OOC)OOC

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.35
GAA P10253 2/20 0.32
ALDH1A1 P00352 4/20 0.32
CYP3A4 P08684 2/20 0.32
ALOX15 P16050 2/20 0.32
TSHR P16473 2/20 0.32
ALOX12 P18054 2/20 0.32
HSD17B10 Q99714 2/20 0.32
LMNA P02545 1/20 0.32
THRB P10828 1/20 0.32
RECQL P46063 1/20 0.32
ATM Q13315 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32
MAPK1 P28482 1/20 0.31
HIF1A Q16665 1/20 0.31
TACR1 P25103 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
HPGD P15428 1/20 0.30
MAPT P10636 1/20 0.30
AOC3 Q16853 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28867259 0.91 HDAC8 (0.35) TDP1ALDH1A1HSD17B10MAPK1SMN1; SMN2
SCHEMBL27634678 0.88 TDP1 (0.37) TDP1GAAALDH1A1CYP3A4ALOX15
SCHEMBL11637355 0.79 TDP1 (0.43) TDP1GAAALDH1A1CYP3A4ALOX15
SCHEMBL11642249 0.74 TDP1 (0.42) TDP1GAAALDH1A1CYP3A4ALOX15
SCHEMBL29055866 0.70 TDP1 (0.38) TDP1GAAALDH1A1CYP3A4ALOX15
SCHEMBL11637422 0.68 TDP1 (0.39) TDP1ALDH1A1MAPK1SMN1; SMN2MAPT
SCHEMBL2117717 0.68 TDP1 (0.39) TDP1GAAALDH1A1CYP3A4ALOX15
SCHEMBL11639501 0.68 TDP1 (0.46) TDP1GAAALDH1A1CYP3A4ALOX15
SCHEMBL14541275 0.67 TDP1 (0.50) TDP1GAAALDH1A1CYP3A4ALOX15
SCHEMBL11634711 0.67 HDAC8 (0.41) TDP1ALDH1A1PRSS1CTSGCTRB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110476243-A The manufacturing method of electronic circuit protection materials, electronic circuit protection materials sealing material, encapsulating method and semiconductor device HITACHI CHEMICAL CO LTD 2019-11-19 CN disclosed
CN-110461938-A Epoxy resin composition and electronic component device HITACHI CHEMICAL CO LTD 2019-11-15 CN disclosed
CN-106024654-B Semiconductor device 日立化成株式会社 2019-07-02 CN disclosed
CN-109071780-A Epoxy resin composition and electronic component device 日立化成株式会社 2018-12-21 CN disclosed
CN-108192293-A Electronic component-use liquid resin composition and electronic part apparatus 日立化成工业株式会社 2018-06-22 CN disclosed
CN-105315618-B Electronic component-use liquid resin composition and its manufacturing method and electronic part apparatus 日立化成工业株式会社 2018-05-29 CN disclosed
CN-103183925-B Liquid resin composition for electronic component, method for producing same, and electronic component device 日立化成工业株式会社 2017-09-08 CN disclosed
CN-104629262-B Electronic component-use liquid resin composition and electronic part apparatus 日立化成工业株式会社 2017-07-18 CN disclosed