SCHEMBL28867259

SCHEMBL28867259

CCCCC(Nc1ccccc1)O[Si](OOC)(OOC)OOC

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC8 Q9BY41 10/20 0.35
HDAC3 O15379 8/20 0.35
HDAC6 Q9UBN7 8/20 0.35
HDAC1 Q13547 7/20 0.35
HDAC2 Q92769 7/20 0.35
HDAC4 P56524 4/20 0.35
HDAC7 Q8WUI4 4/20 0.35
HDAC10 Q969S8 4/20 0.35
HDAC11 Q96DB2 4/20 0.35
HDAC9 Q9UKV0 4/20 0.35
HDAC5 Q9UQL6 4/20 0.35
ALDH1A1 P00352 2/20 0.35
MEN1 O00255 1/20 0.35
MAPT P10636 1/20 0.35
MAPK1 P28482 1/20 0.35
KMT2A Q03164 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
HSD17B10 Q99714 1/20 0.34
ENPP2 Q13822 1/20 0.34
TDP1 Q9NUW8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28154641 0.91 TDP1 (0.35) ALDH1A1MAPTMAPK1SMN1; SMN2HSD17B10
SCHEMBL27634678 0.85 TDP1 (0.37) ALDH1A1MEN1MAPTMAPK1KMT2A
SCHEMBL11637422 0.75 TDP1 (0.39) HDAC8HDAC3HDAC6HDAC1HDAC2
SCHEMBL11634711 0.74 HDAC8 (0.41) HDAC8HDAC3HDAC6HDAC1HDAC2
SCHEMBL8695494 0.73 PRSS1 (0.39) HDAC8HDAC3HDAC6HDAC1HDAC2
SCHEMBL11640867 0.71 TDP1 (0.38) HDAC8HDAC3HDAC6HDAC1HDAC2
SCHEMBL11637816 0.70 LTA4H (0.40) HDAC8HDAC3HDAC6HDAC1HDAC2
SCHEMBL11639632 0.70 HDAC8 (0.40) HDAC8HDAC3HDAC6HDAC1HDAC2
SCHEMBL11637355 0.70 TDP1 (0.43) ALDH1A1MAPTMAPK1KMT2ASMN1; SMN2
SCHEMBL11638353 0.69 HDAC8 (0.39) HDAC8HDAC3HDAC6HDAC1HDAC2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109071922-A liquid epoxy resin composition for sealing and electronic component device 日立化成株式会社 2018-12-21 CN disclosed