SCHEMBL28219622

SCHEMBL28219622

C=C(CCCCO)C(=O)OC.C=CO

nearest known ligand 0.38

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.38
LMNA P02545 1/20 0.38
GPR84 Q9NQS5 1/20 0.34
FFAR1 O14842 1/20 0.34
FFAR4 Q5NUL3 1/20 0.34
SMN1; SMN2 Q16637 2/20 0.33
KDM4E B2RXH2 1/20 0.33
GAA P10253 1/20 0.33
FNTA P49354 1/20 0.32
FNTB P49356 1/20 0.32
TSHR P16473 2/20 0.31
CYP4F2 P78329 2/20 0.31
CYP4A11 Q02928 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21811809 0.92 ALDH1A1 (0.41) ALDH1A1LMNAGPR84FFAR1FFAR4
Ethylene Glycol SCHEMBL28292715 0.90 ALDH1A1 (0.39) ALDH1A1LMNAGPR84FFAR1FFAR4
SCHEMBL21816931 0.90 GPR84 (0.43) ALDH1A1LMNAGPR84FFAR1FFAR4
Ethylene SCHEMBL28262200 0.90 ALDH1A1 (0.39) ALDH1A1LMNAGPR84FFAR1FFAR4
SCHEMBL27975076 0.90 GPR84 (0.43) ALDH1A1LMNAGPR84FFAR1FFAR4
SCHEMBL8980516 0.90 GPR84 (0.43) ALDH1A1LMNAGPR84FFAR1FFAR4
SCHEMBL28073959 0.90 ALDH1A1 (0.39) ALDH1A1LMNAGPR84FFAR1FFAR4
SCHEMBL28248080 0.89 ALDH1A1 (0.43) ALDH1A1LMNAGPR84FFAR1FFAR4
Acrylic Acid Methyl Ester SCHEMBL28106164 0.88 TSHR (0.36) ALDH1A1LMNAGPR84FFAR1FFAR4
SCHEMBL28189185 0.87 ALDH1A1 (0.34) ALDH1A1LMNAGPR84FFAR1FFAR4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110249414-A Piece is used in curable resin film and the formation of the first protective film 琳得科株式会社 2019-09-17 CN disclosed
CN-109791887-A Piece is used in the formation of first protective film 琳得科株式会社 2019-05-21 CN disclosed
CN-109789666-A Composite sheet is used in protective film formation 琳得科株式会社 2019-05-21 CN disclosed
CN-109287125-A The manufacturing method of semiconductor chip with protective film and the manufacturing method of semiconductor device 琳得科株式会社 2019-01-29 CN disclosed
CN-109075047-A The manufacturing method of the manufacturing method and semiconductor device of protective film formation composite sheet and the semiconductor chip with protective film 琳得科株式会社 2018-12-21 CN disclosed
CN-109075046-A The manufacturing method of semiconductor chip with protective film and the manufacturing method of semiconductor device 琳得科株式会社 2018-12-21 CN disclosed
CN-109071845-A Protective film formation film and protective film formation composite sheet 琳得科株式会社 2018-12-21 CN disclosed
CN-109041580-A Film-like adhesive, sheet for semiconductor processing, and method for manufacturing semiconductor device 琳得科株式会社 2018-12-18 CN disclosed
CN-109005665-A SEMICONDUCTOR PROCESSING SHEET 琳得科株式会社 2018-12-14 CN disclosed
CN-109005667-A Protective film-forming film and composite sheet for forming protective film 琳得科株式会社 2018-12-14 CN disclosed
CN-108604541-A Protective film formation film and protective film formation composite sheet 琳得科株式会社 2018-09-28 CN disclosed
CN-108604542-A Protective film-forming film and composite sheet for forming protective film 琳得科株式会社 2018-09-28 CN disclosed
CN-108352365-A Protective film formation piece 琳得科株式会社 2018-07-31 CN disclosed
CN-108260356-A Curable resin film and the 1st protective film formation piece 琳得科株式会社 2018-07-06 CN disclosed
CN-108243614-A Curable resin film and the 1st protective film formation piece 琳得科株式会社 2018-07-03 CN disclosed
CN-108140586-A Thermosetting resin film, sheet for forming No. 1 protective film, and method for forming No. 1 protective film 琳得科株式会社 2018-06-08 CN disclosed
CN-108140585-A 1st protective film formation piece 琳得科株式会社 2018-06-08 CN disclosed
CN-108138012-A Sheet for forming No. 1 protective film, method for forming No. 1 protective film, and method for manufacturing semiconductor chip 琳得科株式会社 2018-06-08 CN disclosed
CN-108140567-A Curable resin film and the 1st protective film formation piece 琳得科株式会社 2018-06-08 CN disclosed
CN-108140622-A Kit of thermosetting resin film and 2 nd protective film forming film, thermosetting resin film, 1 st protective film forming sheet, and method for forming 1 st protective film for semiconductor wafer 琳得科株式会社 2018-06-08 CN disclosed