SCHEMBL28230892

SCHEMBL28230892

CCCCO[Si](CCCC(N)=O)(OC)OC

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SOAT1 P35610 2/20 0.37
MEN1 O00255 1/20 0.37
FAAH O00519 1/20 0.37
TP53 P04637 1/20 0.37
CYP1A2 P05177 1/20 0.37
CYP3A4 P08684 1/20 0.37
CYP2C19 P33261 1/20 0.37
KMT2A Q03164 1/20 0.37
LMNA P02545 1/20 0.35
CNR1 P21554 1/20 0.35
ALDH1A1 P00352 1/20 0.34
KDM4E B2RXH2 2/20 0.34
ATM Q13315 1/20 0.32
MAPT P10636 1/20 0.32
RAB9A P51151 1/20 0.32
NPSR1 Q6W5P4 1/20 0.32
DGKA P23743 1/20 0.32
CASP2 P42575 1/20 0.31
HPGD P15428 1/20 0.31
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27600588 0.91 SOAT1 (0.34) SOAT1MEN1FAAHTP53CYP1A2
SCHEMBL27603258 0.86 CYP1A2 (0.32) CYP1A2
SCHEMBL28042396 0.86
Ammonia Solution, Strong SCHEMBL27990849 0.85 CYP1A2 (0.31) CYP1A2
SCHEMBL28311836 0.84 CYP1A2 (0.32) SOAT1MEN1FAAHTP53CYP1A2
SCHEMBL27952153 0.82 SOAT1 (0.37) SOAT1MEN1FAAHTP53CYP1A2
SCHEMBL16497215 0.81 LMNA (0.44) CYP3A4LMNAALDH1A1TSHR
SCHEMBL27516755 0.81 LMNA (0.35) SOAT1MEN1FAAHTP53CYP1A2
SCHEMBL28095010 0.79 CYP1A2 (0.40) SOAT1MEN1FAAHTP53CYP1A2
SCHEMBL3623133 0.78 LMNA (0.39) MEN1CYP3A4KMT2ALMNAALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108026652-B Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device, and method for manufacturing printed wiring board JX金属株式会社 2019-10-25 CN disclosed
CN-107046769-B The manufacturing method of printing distributing board laminate and printing distributing board and e-machine JX金属株式会社 2019-09-13 CN disclosed
CN-110117799-A Copper foil with carrier JX日矿日石金属株式会社 2019-08-13 CN disclosed
CN-109951964-A Surface treatment copper foil, Copper foil with carrier, substrate and resin base material JX日矿日石金属株式会社 2019-06-28 CN disclosed
CN-105392297-B Preparation method, the preparation method of copper-cover laminated plate, the preparation method of printing distributing board, the preparation method of e-machine and their product of Copper foil with carrier JX日矿日石金属株式会社 2019-05-17 CN disclosed
CN-105408525-B Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper-clad laminate, and method for producing printed wiring board JX日矿日石金属株式会社 2019-03-08 CN disclosed
CN-104812944-B Copper foil with carrier JX日矿日石金属株式会社 2019-02-19 CN disclosed
CN-105814242-B Surface-treated copper foil, copper-clad laminate, printed wiring board, electronic device, and method for manufacturing printed wiring board JX金属株式会社 2018-08-10 CN disclosed
CN-105980609-B The manufacturing method of surface treatment copper foil, copper-cover laminated plate, printing distributing board, e-machine and printing distributing board JX金属株式会社 2018-08-07 CN disclosed
CN-108277509-A Copper foil with carrier JX日矿日石金属株式会社 2018-07-13 CN disclosed