SCHEMBL28243190

SCHEMBL28243190

CCCCCCCCNC1CCC1

nearest known ligand 0.66

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
GNAI3 P08754 2/20 0.66
GNAO1 P09471 2/20 0.66
GNAI1 P63096 2/20 0.66
S1PR4 O95977 2/20 0.60
S1PR1 P21453 2/20 0.60
S1PR3 Q99500 2/20 0.60
S1PR5 Q9H228 1/20 0.60
EPHX1 P07099 11/20 0.55
EPHX2 P34913 2/20 0.49
GBA1 P04062 5/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28207776 1.00 GNAI3 (0.66) GNAI3GNAO1GNAI1S1PR4S1PR1
SCHEMBL21367529 1.00 GNAI3 (0.66) GNAI3GNAO1GNAI1S1PR4S1PR1
SCHEMBL1433258 0.98 GNAI3 (0.62) GNAI3GNAO1GNAI1S1PR4S1PR1
SCHEMBL9801904 0.95 GNAI3 (0.66) GNAI3GNAO1GNAI1S1PR4S1PR1
SCHEMBL1485554 0.95 GNAI3 (0.66) GNAI3GNAO1GNAI1S1PR4S1PR1
SCHEMBL9801333 0.95 GNAI3 (0.66) GNAI3GNAO1GNAI1S1PR4S1PR1
SCHEMBL9801513 0.95 GNAI3 (0.66) GNAI3GNAO1GNAI1S1PR4S1PR1
SCHEMBL9801263 0.95 GNAI3 (0.66) GNAI3GNAO1GNAI1S1PR4S1PR1
SCHEMBL9801953 0.95 GNAI3 (0.66) GNAI3GNAO1GNAI1S1PR4S1PR1
SCHEMBL9801024 0.95 GNAI3 (0.66) GNAI3GNAO1GNAI1S1PR4S1PR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108602955-B Photocuring method, compound used in photocuring method, and composition 富士胶片和光纯药株式会社 2021-08-06 CN disclosed
CN-107848963-B Acid-resistant alkali-producing agent and/or radical-producing agent, and curable resin composition containing same 富士胶片和光纯药株式会社 2020-11-03 CN disclosed
CN-110678500-A Photo-or thermosetting method and curable resin composition 富士胶片和光纯药株式会社 2020-01-10 CN disclosed
CN-108602955-A The compound and composition used in process for photocuring, the process for photocuring 富士胶片和光纯药株式会社 2018-09-28 CN disclosed