SCHEMBL28256797

SCHEMBL28256797

CCCCCCCCC(Cl)c1cccc2oc3ccccc3c(=O)c12

nearest known ligand 0.50

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
▸ MAOA P21397 3/20 0.44
▸ NQO1 P15559 1/20 0.43
▸ TOP2A P11388 2/20 0.42
▸ KDM4E B2RXH2 1/20 0.41
▸ ALDH1A1 P00352 1/20 0.41
▸ GLA P06280 1/20 0.41
▸ CYP3A4 P08684 1/20 0.41
▸ MAPT P10636 1/20 0.41
▸ HPGD P15428 1/20 0.41
▸ PGAM1 P18669 1/20 0.41
▸ CASP1 P29466 1/20 0.41
▸ CASP7 P55210 1/20 0.41
▸ SMN1; SMN2 Q16637 1/20 0.41
▸ HSD17B10 Q99714 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9319215 0.80 CYP17A1 (0.41) MAOANQO1TOP2AKDM4EALDH1A1
SCHEMBL28284760 0.79 MAOA (0.45) MAOANQO1KDM4EALDH1A1GLA
SCHEMBL9319212 0.78 MAOA (0.42) MAOANQO1KDM4EALDH1A1GLA
SCHEMBL11344866 0.75 MAOA (0.49) MAOATOP2AKDM4EALDH1A1GLA
SCHEMBL6686380 0.74 KDM4E (0.44) KDM4EALDH1A1HPGDSMN1; SMN2
SCHEMBL6685064 0.74 KDM4E (0.44) KDM4EALDH1A1HPGDSMN1; SMN2
SCHEMBL31730219 0.73 MAOA (0.57) MAOAKDM4EALDH1A1GLACYP3A4
SCHEMBL476564 0.73 MAOA (0.57) MAOAKDM4EALDH1A1GLACYP3A4
SCHEMBL29254203 0.73 MAOA (0.50) MAOATOP2AKDM4EALDH1A1GLA
SCHEMBL6681471 0.72 ALDH1A1 (0.43) KDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109844051-A Adhesive composition 株式会社钟化 2019-06-04 — — CN disclosed
CN-109563250-A Polymer, composition, formed body, hardening thing and laminated body JSR株式会社 2019-04-02 — — CN disclosed
CN-105899616-B Curable organopolysiloxane composition and release film for use with dielectric ceramic layer-forming material using the same 道康宁东丽株式会社 2019-02-22 — — CN disclosed
CN-109312052-A Epoxy (methyl) acrylate compounds and the solidification compound for containing epoxy (methyl) acrylate compounds 昭和电工株式会社 2019-02-05 — — CN disclosed
CN-109072009-A Protective film-forming film and composite sheet for forming protective film 琳得科株式会社 2018-12-21 — — CN disclosed
CN-109071804-A Polymer, composition, molded body, cured product, and laminate JSR株式会社 2018-12-21 — — CN disclosed
CN-107429088-A Hardcoats and related compositions, methods, and articles 美国道康宁公司 2017-12-01 — — CN disclosed
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