SCHEMBL28291863

SCHEMBL28291863

CCc1[c]cccc1.Cc1[c]c(C)cc(C)c1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24915 0.82
SCHEMBL28832858 0.80
SCHEMBL28088171 0.75 TP53 (0.32)
SCHEMBL27957914 0.75 TP53 (0.32)
SCHEMBL466431 0.72 NOS3 (0.31)
SCHEMBL12488211 0.70 TACR1 (0.33)
Benzene SCHEMBL8022186 0.68 ACHE (0.37)
SCHEMBL18896 0.68
SCHEMBL215511 0.66
SCHEMBL17730 0.66

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106661202-B Aluminum chelate-based latent curing agent, process for producing the same, and thermosetting epoxy resin composition 迪睿合株式会社 2019-04-09 CN disclosed
CN-106661202-A Aluminum chelate-based latent curing agent, process for producing the same, and thermosetting epoxy resin composition 迪睿合株式会社 2017-05-10 CN disclosed