SCHEMBL2829581

SCHEMBL2829581

CCCc1[c]c(CCC)c[c]c1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4072469 0.93
SCHEMBL4071748 0.85
SCHEMBL2828664 0.84 NPC1 (0.31)
SCHEMBL2828471 0.77
SCHEMBL7570601 0.70
SCHEMBL1780256 0.70 NOS2 (0.39)
SCHEMBL147801 0.70 CNR1 (0.37)
SCHEMBL820116 0.67 GABRA1 (0.31)
SCHEMBL4250729 0.67
SCHEMBL296510 0.67 CNR1 (0.38)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3778748-B1 NONHALOGEN FLAME RETARDANT RESIN COMPOSITION AND FLAME RETARDANT RESIN MOLDED ARTICLE MANUFACTURED THEREFROM LG CHEMICAL LTD (KR) 2023-04-26 EP claimed
EP-3083832-B1 POLYAMIDE MOULDING MATERIAL AND ITS APPLICATION EMS PATENT AG (CH) 2019-05-22 EP claimed
EP-1311612-B1 REACTOR ALLOY OF SYNDIOTACTIC POLYSTYRENE HAVING HIGH IMPACT RESISTANCE SAMSUNG ATOFINA CO LTD (KR) 2007-02-28 EP claimed
EP-0618985-B1 POLYMERIC MONOFILAMENT AND FELT MADE THEREFROM ALLIED SIGNAL INC (US) 1996-09-04 EP claimed
EP-0199510-B1 POLYPHENYLENE ETHER RESIN COMPOSITION Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1990-09-12 EP claimed
EP-0052854-B1 POLYPHENYLENE OXIDE COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1986-07-02 EP claimed
US-20100160555-A1 RESIN COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2010-06-24 US disclosed
US-20100144926-A1 EPOXY RESIN COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2010-06-10 US disclosed
US-20100063182-A1 EPOXY COMPOSITION HITACHI, LTD. (JP) 2010-03-11 US disclosed
EP-2138521-A1 EPOXY COMPOSITION Sumitomo Chemical Company, Limited (JP) 2009-12-30 EP disclosed
EP-2133379-A1 EPOXY RESIN COMPOSITION Sumitomo Chemical Company, Limited (JP) 2009-12-16 EP disclosed
EP-2133380-A1 RESIN COMPOSITION Sumitomo Chemical Company, Limited (JP) 2009-12-16 EP disclosed
EP-0200185-B1 THERMOPLASTIC MOULDING MASS BASF Aktiengesellschaft (DE) 1988-11-30 EP disclosed