SCHEMBL2830458

SCHEMBL2830458

CCC1(COCCOCCOCC2(CC)COC2)COC1

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.33
EPHX1 P07099 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL216342 1.00 TSHR (0.33) TSHREPHX1
SCHEMBL217129 1.00 TSHR (0.33) TSHREPHX1
SCHEMBL2830527 1.00 TSHR (0.33) TSHREPHX1
SCHEMBL213172 0.98 TSHR (0.34) TSHREPHX1
SCHEMBL464901 0.94 TSHR (0.31) TSHR
SCHEMBL13301281 0.92 ASGR1 (0.32) TSHR
SCHEMBL13301284 0.92 ASGR1 (0.32) TSHR
SCHEMBL11990061 0.91 TSHR (0.32) TSHR
SCHEMBL13294313 0.91 TSHR (0.32) TSHR
SCHEMBL214598 0.90 TSHR (0.38) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120153318-A Photosensitive resin composition, method for producing cured relief pattern using same, and method for producing polyimide film 旭化成株式会社 2025-06-13 CN disclosed
CN-120129876-A Negative photosensitive resin composition, method for producing polyimide cured film using same, and polyimide cured film 旭化成株式会社 2025-06-10 CN disclosed
CN-119213364-A Photosensitive resin composition, method for producing polyimide cured film using same, and polyimide cured film 旭化成株式会社 2024-12-27 CN disclosed
CN-118938601-A Negative photosensitive resin composition and method for producing cured relief pattern 旭化成株式会社 2024-11-12 CN disclosed
CN-116507686-B UV-VIS radiation curable security ink for producing dichroic security features 锡克拜控股有限公司 2024-08-16 CN disclosed
CN-118363270-A Negative photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2024-07-19 CN disclosed
US-20240180788-A1 PHOTOCATIONICALLY CURABLE COMPOSITION TOKUYAMA DENTAL CORPORATION (JP) 2024-06-06 US disclosed
CN-113811556-B Photosensitive resin composition, resin film and electronic device 住友电木株式会社 2024-05-28 CN disclosed
WO-2024038705-A1 CATIONICALLY POLYMERIZABLE RESIN COMPOSITION FOR 3D STEREOLITHOGRAPHY AND METHOD FOR PRODUCING 3D STEREOLITHOGRAPHY PRODUCT 株式会社トクヤマデンタル 2024-02-22 WO disclosed
EP-4310128-A1 PHOTOCATIONICALLY CURABLE COMPOSITION Tokuyama Dental Corporation (JP) 2024-01-24 EP disclosed
EP-2639638-A1 Positive photosensitive resin composition, and semiconductor device and display therewith Sumitomo Bakelite Co., Ltd. (JP) 2013-09-18 EP disclosed
US-20120288798-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM AND ELECTRONIC COMPONENT HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2012-11-15 US disclosed
US-20100197491-A1 METHOD FOR PRODUCTION OF WATER-ABSORBABLE RESIN, AND WATER-ABSORBABLE RESIN PRODUCED BY THE METHOD SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) 2010-08-05 US disclosed
US-7728050-B2 Curable composition, ink composition, inkjet recording method, printed matter, method for producing planographic printing plate, planographic printing plate and oxetane compound FUJIFILM CORPORATION (JP) 2010-06-01 US disclosed
US-7728050-B2 Curable composition, ink composition, inkjet recording method, printed matter, method for producing planographic printing plate, planographic printing plate and oxetane compound FUJIFILM CORPORATION (JP) 2010-06-01 US disclosed
EP-2177566-A1 METHOD FOR PRODUCTION OF WATER-ABSORBABLE RESIN, AND WATER-ABSORBABLE RESIN PRODUCED BY THE METHOD SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) 2010-04-21 EP disclosed
EP-1965256-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE AND DISPLAY USING SAME SUMITOMO BAKELITE CO., LTD. (JP) 2008-09-03 EP disclosed
US-20070112088-A1 Curable composition, ink composition, inkjet recording method, printer matter, method for producing planographic printing plate, planographic printing plate and oxetane compound FUJIFILM CORPORATION 2007-05-17 US disclosed
US-20070112088-A1 Curable composition, ink composition, inkjet recording method, printer matter, method for producing planographic printing plate, planographic printing plate and oxetane compound FUJIFILM CORPORATION 2007-05-17 US disclosed
EP-1783184-A1 Curable ink composition and oxetane compound Fujifilm Corporation (JP) 2007-05-09 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20240180788-A1 PHOTOCATIONICALLY CURABLE COMPOSITION CRY1, CRY2, TYR TSHR 4550/4885EPHX1 1376/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.