SCHEMBL2830702

SCHEMBL2830702

COc1ccc(C=Cc2nc3ccccc3s2)cc1O

nearest known ligand 0.73

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 9/20 0.73
MEN1 O00255 6/20 0.73
KMT2A Q03164 6/20 0.73
GAA P10253 4/20 0.73
RAB9A P51151 4/20 0.73
KDM4E B2RXH2 4/20 0.73
HTT P42858 2/20 0.73
ALDH1A1 P00352 2/20 0.73
POLB P06746 1/20 0.73
SMN1; SMN2 Q16637 4/20 0.65
ATM Q13315 1/20 0.65
TDP1 Q9NUW8 1/20 0.65
GPR55 Q9Y2T6 1/20 0.65
NPC1 O15118 3/20 0.60
MAPK1 P28482 2/20 0.60
NPSR1 Q6W5P4 2/20 0.58
HCRTR1 O43613 1/20 0.58
TP53 P04637 1/20 0.58
HPGD P15428 1/20 0.58
BLM P54132 1/20 0.58

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19695963 0.90 MAPT (0.77) MAPTMEN1KMT2AGAARAB9A
SCHEMBL23111697 0.90 MAPT (0.77) MAPTMEN1KMT2AGAARAB9A
SCHEMBL2526641 0.88 MAPT (0.74) MAPTMEN1KMT2AGAARAB9A
SCHEMBL2526639 0.88 MAPT (0.74) MAPTMEN1KMT2AGAARAB9A
SCHEMBL9516881 0.85 MAPT (0.66) MAPTMEN1KMT2AGAARAB9A
SCHEMBL9516889 0.85 MAPT (0.66) MAPTMEN1KMT2AGAARAB9A
SCHEMBL12866134 0.84 SNCA (0.64) MAPTMEN1KMT2AGAARAB9A
SCHEMBL16180704 0.81 MAPT (0.79) MAPTMEN1KMT2AGAARAB9A
SCHEMBL17576070 0.81 MAPT (0.79) MAPTMEN1KMT2AGAARAB9A
SCHEMBL16180705 0.81 MAPT (0.79) MAPTMEN1KMT2AGAARAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118290880-A Polymer composition and single layer phase difference material 日产化学株式会社 2024-07-05 CN disclosed
WO-2024071364-A1 POLYMER COMPOSITION AND SINGLE-LAYER RETARDATION MATERIAL 日産化学株式会社 2024-04-04 WO disclosed
CN-113557265-B Polymer composition and single layer phase difference material 日产化学株式会社 2024-03-08 CN disclosed
CN-117425695-A Curable composition and cured product 综研化学株式会社 2024-01-19 CN disclosed
CN-113574119-B Polymer composition and single layer phase difference material 日产化学株式会社 2024-01-16 CN disclosed
CN-117186663-A Liquid crystal aligning agent, liquid crystal alignment film and liquid crystal display element 日产化学工业株式会社 2023-12-08 CN disclosed
WO-2023171760-A1 PHASE DIFFERENCE FILM COMPOSITION AND SINGLE-LAYER PHASE DIFFERENCE MATERIAL 日産化学株式会社 2023-09-14 WO disclosed
WO-2023171757-A1 POLYMER COMPOSITION, SINGLE LAYER PHASE DIFFERENCE MATERIAL, AND LIQUID CRYSTAL ALIGNMENT AGENT 日産化学株式会社 2023-09-14 WO disclosed
WO-2023095925-A1 POLYMER COMPOSITION AND SINGLE-LAYER RETARDATION MATERIAL 日産化学株式会社 2023-06-01 WO disclosed
WO-2023008488-A1 POLYMER COMPOSITION AND SINGLE-LAYER RETARDATION MATERIAL 日産化学株式会社 2023-02-02 WO disclosed
US-7632906-B2 Polymerizable copolymers for alignment layers ROLIC AG (CH) 2009-12-15 US disclosed
US-7361432-B2 Composition for hologram-recording material, hologram-recording medium, and process for producing the same NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 2008-04-22 US disclosed
EP-1644425-B1 POLYMERIZABLE COPOLYMERS FOR ALIGNMENT LAYERS ROLIC AG (CH) 2007-12-26 EP disclosed
US-20070179266-A1 Polymerizable copolymers for alignment layers ROLIC AG (CH) 2007-08-02 US disclosed
US-6899999-B2 Method of manufacturing composite member, photosensitive composition, porous base material, insulating body and composite member KABUSHIKI KAISHA TOSHIBA (JP) 2005-05-31 US disclosed
US-6835889-B2 Passive element component and substrate with built-in passive element KABUSHIKI KAISHA TOSHIBA (JP) 2004-12-28 US disclosed
US-20040096776-A1 Composition for hologram-recording material, hologram-recording medium, and process for producing the same Daiso, Co., Ltd. (JP) 2004-05-20 US disclosed
EP-1376268-A1 COMPOSITION FOR HOLOGRAM-RECORDING MATERIAL, HOLOGRAM-RECORDING MEDIUM, AND PROCESS FOR PRODUCING THE SAME National Institute of Advanced Industrial Science and Technology (JP) 2004-01-02 EP disclosed
US-20030096172-A1 Hologram recording material composition and hologram recording medium DAISO CO., LTD. (JP) 2003-05-22 US disclosed
US-20030022102-A1 Method of manufacturing composite member, photosensitive composition, porous base material, insulating body and composite member KABUSHIKI KAISHA TOSHIBA (JP) 2003-01-30 US disclosed