SCHEMBL28333337

SCHEMBL28333337

CC(=O)ONc1ccccc1O

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 8/20 0.49
MAPT P10636 6/20 0.49
KMT2A Q03164 4/20 0.49
KDM4E B2RXH2 2/20 0.49
TDP1 Q9NUW8 1/20 0.49
LMNA P02545 5/20 0.44
HTT P42858 4/20 0.44
NPC1 O15118 3/20 0.44
TP53 P04637 2/20 0.44
HPGD P15428 3/20 0.42
TSHR P16473 2/20 0.42
CA12 O43570 1/20 0.41
CA1 P00915 1/20 0.41
CA2 P00918 1/20 0.41
CA7 P43166 1/20 0.41
CA9 Q16790 1/20 0.41
CA14 Q9ULX7 1/20 0.41
MEN1 O00255 3/20 0.41
MAPK1 P28482 3/20 0.41
RAB9A P51151 3/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29134605 0.79 GAA (0.44) GAAMAPTKMT2AKDM4ETDP1
SCHEMBL8121555 0.78 ALDH1A1 (0.55) KMT2ALMNAHTTHPGDTSHR
SCHEMBL29290654 0.78 TOP1 (0.41) KMT2AKDM4ETDP1NPC1HPGD
SCHEMBL28111105 0.78 RAB9A (0.52) GAAMAPTKMT2AKDM4ELMNA
SCHEMBL25502829 0.78 HDAC1 (0.46) GAAMAPTKMT2AKDM4ETDP1
SCHEMBL28197116 0.78 CYP1A2 (0.46) MAPTKMT2ALMNANPC1HPGD
SCHEMBL5925582 0.77 KDM4E (0.50) MAPTKMT2AKDM4ETDP1LMNA
SCHEMBL28333323 0.77 KMT2A (0.53) GAAMAPTKMT2AKDM4ETDP1
SCHEMBL14166590 0.76 ALDH1A1 (0.41) MAPTKMT2AKDM4ETDP1LMNA
SCHEMBL6750341 0.76 KDM4E (0.53) GAAMAPTKMT2AKDM4ENPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108884325-B Resin composition containing liquid crystal polymer particles, molded article using the same, and method for producing the same 宝理塑料株式会社 2020-08-04 CN claimed
CN-114958287-A Adhesive composition, cured product, adhesive sheet, copper foil with resin, copper-clad laminate, and printed wiring board 荒川化学工业株式会社 2022-08-30 CN disclosed
CN-108884325-B Resin composition containing liquid crystal polymer particles, molded article using the same, and method for producing the same 宝理塑料株式会社 2020-08-04 CN disclosed
CN-110407751-A The preparation method of N- Methoxyphenylamino methyl formate UNIV WUHAN SCIENCE & TECH 2019-11-05 CN disclosed