⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL238666 | 0.89 | — | — | |
| SCHEMBL3925794 | 0.89 | — | — | |
| SCHEMBL28708552 | 0.80 | — | — | |
| SCHEMBL14656880 | 0.80 | — | — | |
| SCHEMBL15456566 | 0.80 | — | — | |
| SCHEMBL28466444 | 0.80 | — | — | |
| SCHEMBL29191840 | 0.80 | — | — | |
| SCHEMBL999554 | 0.80 | — | — | |
| SCHEMBL15213 | 0.78 | — | — | |
| SCHEMBL23201297 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11894556-B2 | Anode material for secondary battery, anode for secondary battery and secondary battery | NATIONAL TSING HUA UNIVERSITY (TW) | 2024-02-06 | — | — | US | claimed |
| CN-114864926-B | Negative electrode material for secondary battery, negative electrode, and secondary battery | 游萃蓉 | 2023-08-15 | — | — | CN | claimed |
| CN-114864926-A | Negative electrode material for secondary battery, negative electrode, and secondary battery | 游萃蓉 | 2022-08-05 | — | — | CN | claimed |
| US-20210226208-A1 | ANODE MATERIAL FOR SECONDARY BATTERY, ANODE FOR SECONDARY BATTERY AND SECONDARY BATTERY | NATIONAL TSING HUA UNIVERSITY (TW) | 2021-07-22 | — | — | US | claimed |
| CN-113130889-A | Negative electrode material for secondary battery, negative electrode, and secondary battery | 游萃蓉 | 2021-07-16 | — | — | CN | claimed |
| US-8821750-B2 | Metal polishing slurry and polishing method | HITACHI CHEMICAL CO., LTD. (JP) | 2014-09-02 | — | — | US | claimed |
| US-8681282-B2 | Liquid crystal display device | ALTIAM SERVICES LTD. LLC (US) | 2014-03-25 | — | — | US | claimed |
| US-RE44817-E1 | Copper alloy and liquid-crystal display device | ALTIAM SERVICES LTD. LLC (US) | 2014-03-25 | — | — | US | claimed |
| US-20120267628-A1 | Liquid Crystal Display Device | XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY | 2012-10-25 | — | — | US | claimed |
| US-20100120250-A1 | METAL POLISHING SLURRY AND POLISHING METHOD | HITACHI CHEMICAL CO., LTD. (JP) | 2010-05-13 | — | — | US | claimed |
| US-11901554-B2 | Anode material for secondary battery, anode for secondary battery and secondary battery | NATIONAL TSING HUA UNIVERSITY (TW) | 2024-02-13 | — | — | US | disclosed |
| US-11901554-B2 | Anode material for secondary battery, anode for secondary battery and secondary battery | NATIONAL TSING HUA UNIVERSITY (TW) | 2024-02-13 | — | — | US | disclosed |
| US-11894556-B2 | Anode material for secondary battery, anode for secondary battery and secondary battery | NATIONAL TSING HUA UNIVERSITY (TW) | 2024-02-06 | — | — | US | disclosed |
| US-11894556-B2 | Anode material for secondary battery, anode for secondary battery and secondary battery | NATIONAL TSING HUA UNIVERSITY (TW) | 2024-02-06 | — | — | US | disclosed |
| CN-114725360-B | Negative electrode material for secondary battery, negative electrode, and secondary battery | 游萃蓉 | 2024-01-23 | — | — | CN | disclosed |
| US-20210226208-A1 | ANODE MATERIAL FOR SECONDARY BATTERY, ANODE FOR SECONDARY BATTERY AND SECONDARY BATTERY | NATIONAL TSING HUA UNIVERSITY (TW) | 2021-07-22 | — | — | US | disclosed |
| CN-113130889-A | Negative electrode material for secondary battery, negative electrode, and secondary battery | 游萃蓉 | 2021-07-16 | — | — | CN | disclosed |
| CN-113130889-A | Negative electrode material for secondary battery, negative electrode, and secondary battery | 游萃蓉 | 2021-07-16 | — | — | CN | disclosed |
| US-8821750-B2 | Metal polishing slurry and polishing method | HITACHI CHEMICAL CO., LTD. (JP) | 2014-09-02 | — | — | US | disclosed |
| US-20100120250-A1 | METAL POLISHING SLURRY AND POLISHING METHOD | HITACHI CHEMICAL CO., LTD. (JP) | 2010-05-13 | — | — | US | disclosed |