⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28708552 | 0.89 | — | — | |
| SCHEMBL14656880 | 0.89 | — | — | |
| SCHEMBL15456566 | 0.89 | — | — | |
| SCHEMBL2833522 | 0.89 | — | — | |
| SCHEMBL15213 | 0.87 | — | — | |
| SCHEMBL23201297 | 0.82 | — | — | |
| SCHEMBL1378714 | 0.75 | — | — | |
| SCHEMBL562096 | 0.75 | — | — | |
| Ammonia Solution, Strong SCHEMBL25368540 | 0.75 | — | — | |
| SCHEMBL20768711 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 215 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12550787-B2 | Bonded assembly containing bonding pads with metal oxide barriers and methods for forming the same | SanDisk Technologies, Inc. (US) | 2026-02-10 | — | — | US | claimed |
| EP-4523252-A1 | BONDED ASSEMBLY CONTAINING BONDING PADS WITH METAL OXIDE BARRIERS AND METHODS FOR FORMING THE SAME | Sandisk Technologies, Inc. (US) | 2025-03-19 | — | — | EP | claimed |
| CN-118251761-A | Bonding assembly including bond pad with metal oxide barrier and method of forming the same | 桑迪士克科技有限责任公司 | 2024-06-25 | — | — | CN | claimed |
| WO-2023219720-A1 | BONDED ASSEMBLY CONTAINING BONDING PADS WITH METAL OXIDE BARRIERS AND METHODS FOR FORMING THE SAME | SANDISK TECHNOLOGIES LLC (US) | 2023-11-16 | — | — | WO | claimed |
| US-20230361069-A1 | BONDED ASSEMBLY CONTAINING BONDING PADS WITH METAL OXIDE BARRIERS AND METHODS FOR FORMING THE SAME | SanDisk Technologies, Inc. | 2023-11-09 | — | — | US | claimed |
| US-20230298900-A1 | Selective Removal Of An Etching Stop Layer For Improving Overlay Shift Tolerance | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2023-09-21 | — | — | US | claimed |
| US-11664237-B2 | Semiconductor device having improved overlay shift tolerance | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2023-05-30 | — | — | US | claimed |
| CN-115020331-A | Semiconductor structure and preparation method thereof | 长鑫存储技术有限公司 | 2022-09-06 | — | — | CN | claimed |
| US-11362079-B2 | Bonded die assembly containing a manganese-containing oxide bonding layer and methods for making the same | SANDISK TECHNOLOGIES LLC (US) | 2022-06-14 | — | — | US | claimed |
| CN-106409757-B | Method for manufacturing semiconductor device | 三星电子株式会社 | 2022-02-01 | — | — | CN | claimed |
| US-20120133044-A1 | METAL CONTAINING SACRIFICE MATERIAL AND METHOD OF DAMASCENE WIRING FORMATION | TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC. (US) | 2012-05-31 | — | — | US | claimed |
| US-20110285024-A1 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC. (US) | 2011-11-24 | — | — | US | claimed |
| CN-102237309-A | Method for integrating manganese-oxide-based resistive memory with copper interconnection rear end process | UNIV FUDAN | 2011-11-09 | — | — | CN | claimed |
| CN-102237491-A | Manganese oxide base resistance memory containing silicon doping and preparation method thereof | UNIV FUDAN | 2011-11-09 | — | — | CN | claimed |
| US-7354660-B2 | High performance alloys with improved metal dusting corrosion resistance | EXXONMOBIL RESEARCH AND ENGINEERING COMPANY (US) | 2008-04-08 | — | — | US | claimed |
| US-20080023696-A1 | Memory element and semiconductor device | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. (JP) | 2008-01-31 | — | — | US | claimed |
| EP-1883109-A1 | Memory element and method of manufacturing thereof | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. (JP) | 2008-01-30 | — | — | EP | claimed |
| EP-1880033-A2 | HIGH PERFORMANCE ALLOYS WITH IMPROVED METAL DUSTING CORROSION RESISTANCE | EXXONMOBIL RESEARCH AND ENGINEERING COMPANY (US) | 2008-01-23 | — | — | EP | claimed |
| WO-2006121561-A2 | HIGH PERFORMANCE ALLOYS WITH IMPROVED METAL DUSTING CORROSION RESISTANCE | EXXONMOBIL RESEARCH AND ENGINEERING COMPANY (US) | 2006-11-16 | — | — | WO | claimed |
| US-20060257675-A1 | High performance alloys with improved metal dusting corrosion resistance | EXXONMOBIL RESEARCH AND ENGINEERING COMPANY | 2006-11-16 | — | — | US | claimed |