⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31678966 | 1.00 | — | — | |
| SCHEMBL1672678 | 1.00 | — | — | |
| SCHEMBL28689950 | 0.87 | — | — | |
| SCHEMBL30906929 | 0.87 | — | — | |
| SCHEMBL29720892 | 0.87 | — | — | |
| SCHEMBL28338161 | 0.87 | — | — | |
| SCHEMBL28566031 | 0.87 | — | — | |
| SCHEMBL1169745 | 0.87 | — | — | |
| SCHEMBL15733084 | 0.87 | — | — | |
| Phosphine SCHEMBL15455959 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 3760 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117663925-B | Medicinal cup type bridge wire ignition resistor and manufacturing process thereof | Guangde Garui Electronics Co.,Ltd. (CN) | 2026-05-26 | — | — | CN | claimed |
| CN-224265208-U | Hanging basket of PCB nickel palladium gold platelet | 广德先胜电子科技有限公司 | 2026-05-19 | — | — | CN | claimed |
| CN-122042645-A | Preparation method and application of aptamer functionalized nano-enzyme probe for detecting H1N1 virus | 哈尔滨工程大学 | 2026-05-15 | — | — | CN | claimed |
| US-12622308-B2 | Interconnect structure for advanced packaging and method for the same | OIP TECHNOLOGY PTE LTD. (SG) | 2026-05-05 | — | — | US | claimed |
| US-20260114296-A1 | SEMICONDUCTOR PACKAGE HAVING COPPER PLATED SOURCE PADS AND METHOD OF MAKING THE SAME | ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP (CA) | 2026-04-23 | — | — | US | claimed |
| EP-4439656-B1 | SEMICONDUCTOR DEVICE | WINCHAIN MATERIAL TECH CO LTD (TW) | 2026-03-04 | — | — | EP | claimed |
| US-20260060097-A1 | ALL-GLASS STACKED PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF | GUANGDONG FOZHIXIN MICROELECTRONICS CO LTD (CN) | 2026-02-26 | — | — | US | claimed |
| US-12463055-B2 | Package substrate manufacturing method | ZHUHAI ACCESS SEMICONDUCTOR CO., LTD. (CN) | 2025-11-04 | — | — | US | claimed |
| EP-3945605-B1 | SEMICONDUCTOR DIODE AND METHOD FOR MANUFACTURING SUCH A DIODE | COMMISSARIAT ENERGIE ATOMIQUE (FR) | 2025-10-22 | — | — | EP | claimed |
| US-12439562-B2 | Thermal dissipation | STMICROELECTRONICS (GRENOBLE 2) SAS (FR) | 2025-10-07 | — | — | US | claimed |
| US-8384216-B2 | Package structure and manufacturing method thereof | SUBTRON TECHNOLOGY CO., LTD. (TW) | 2013-02-26 | — | — | US | claimed |
| US-20120292762-A1 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | SUBTRON TECHNOLOGY CO. LTD. (TW) | 2012-11-22 | — | — | US | claimed |
| US-20120279772-A1 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | SUBTRON TECHNOLOGY CO. LTD. (TW) | 2012-11-08 | — | — | US | claimed |
| CN-101959374-A | Method for manufacturing multilayer printed circuit board | SAMSUNG ELECTRONICS CO LTD | 2011-01-26 | — | — | CN | claimed |
| WO-2010057933-A1 | INTEGRATED CIRCUIT DEVICE EQUIPPED WITH DIFFERENT CONNECTION MEANS | GEMALTO SA (FR) | 2010-05-27 | — | — | WO | claimed |
| US-7504712-B2 | Electronic device with selective nickel palladium gold plated leadframe and method of making the same | QPL LIMITED (CN) | 2009-03-17 | — | — | US | claimed |
| US-20070235843-A1 | Electronic device with selective nickel palladium gold plated leadframe and method of making the same | QPL LIMITED (CN) | 2007-10-11 | — | — | US | claimed |
| US-5824425-A | Method for joining rhenium to niobium | ALLIED SIGNAL INC (US) | 1998-10-20 | — | — | US | claimed |
| US-5108025-A | Ceramic-metal composite article and joining method | GTE LABORATORIES INCORPORATED (US) | 1992-04-28 | — | — | US | claimed |
| US-4247305-A | Abrasive structures and methods of their preparation | GENERAL ELECTRIC COMPANY (US) | 1981-01-27 | — | — | US | claimed |