SCHEMBL28343138

SCHEMBL28343138

Nc1cc(-c2ccccc2-c2ccc(O)c(N)c2)ccc1O

nearest known ligand 0.69

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.69
ALOX15 P16050 5/20 0.69
HSD17B10 Q99714 5/20 0.69
GAA P10253 5/20 0.69
MEN1 O00255 4/20 0.69
KMT2A Q03164 4/20 0.69
MAPT P10636 4/20 0.69
HPGD P15428 3/20 0.69
ALOX12 P18054 3/20 0.69
HTT P42858 2/20 0.69
KDM4E B2RXH2 2/20 0.69
USP2 O75604 1/20 0.69
LMNA P02545 1/20 0.69
HSP90AA1 P07900 1/20 0.69
APP P05067 1/20 0.64
TSHR P16473 1/20 0.48
SMN1; SMN2 Q16637 4/20 0.46
MAPK1 P28482 1/20 0.46
CYP3A4 P08684 1/20 0.44
ABL1 P00519 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17263732 0.98 ALDH1A1 (0.67) ALDH1A1ALOX15HSD17B10GAAMEN1
SCHEMBL3784701 0.91 ALDH1A1 (0.64) ALDH1A1ALOX15HSD17B10GAAMEN1
SCHEMBL29878592 0.86 MCL1 (0.58) ALDH1A1ALOX15HSD17B10GAAMEN1
SCHEMBL28909735 0.83 ALDH1A1 (0.65) ALDH1A1ALOX15HSD17B10GAAMEN1
SCHEMBL108713 0.83 ALDH1A1 (0.77) ALDH1A1ALOX15HSD17B10GAAMEN1
SCHEMBL28822417 0.83 ALDH1A1 (0.77) ALDH1A1ALOX15HSD17B10GAAMEN1
SCHEMBL29367250 0.83 ALDH1A1 (0.77) ALDH1A1ALOX15HSD17B10GAAMEN1
SCHEMBL305617 0.82 ALOX15 (1.00) ALDH1A1ALOX15HSD17B10GAAMEN1
SCHEMBL29879392 0.82 ALOX15 (1.00) ALDH1A1ALOX15HSD17B10GAAMEN1
SCHEMBL28871380 0.82 HSD17B10 (0.70) ALDH1A1ALOX15HSD17B10GAAMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106574163-B Temporary bonding adhesive, adhesive layer, wafer processed body, method for manufacturing semiconductor device using same, polyimide copolymer, polyimide hybrid resin, and resin composition 东丽株式会社 2019-12-03 CN disclosed