Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ammonia Solution, Strong SCHEMBL4306271 | 0.98 | KDM4E (0.34) | KDM4E | |
| SCHEMBL94667 | 0.84 | KDM4E (0.43) | KDM4E | |
| Ammonia Solution, Strong SCHEMBL5722441 | 0.82 | KDM4E (0.41) | KDM4E | |
| SCHEMBL4932030 | 0.77 | CA4 (0.31) | — | |
| SCHEMBL10694560 | 0.70 | KDM4E (0.35) | KDM4E | |
| SCHEMBL5514879 | 0.69 | KDM4E (0.34) | KDM4E | |
| SCHEMBL9169464 | 0.67 | GAA (0.41) | KDM4E | |
| SCHEMBL1766196 | 0.66 | KDM4E (0.32) | KDM4E | |
| SCHEMBL221253 | 0.66 | ALDH1A1 (0.32) | — | |
| SCHEMBL1766168 | 0.65 | KDM4E (0.31) | KDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7704307-B2 | containing water soluble palladium compound, at least one of ammonia, an amine compound, an aminocarboxylic acid compound, carboxylic acid, and bismuth; plating liquid has good stability and provides a film with excellent corrosion resistance, solder bondability, and wire bondability | NIPPON MINING & METALS CO., LTD. (JP) | 2010-04-27 | — | — | US | disclosed |
| US-20090081369-A1 | containing water soluble palladium compound, at least one of ammonia, an amine compound, an aminocarboxylic acid compound, carboxylic acid, and bismuth; plating liquid has good stability and provides a film with excellent corrosion resistance, solder bondability, and wire bondability | JX NIPPON MINING & METALS CORPORATION (JP) | 2009-03-26 | — | — | US | disclosed |
| US-20080237535-A1 | Composition for polishing semiconductor wafer, and method of producing the same | SPEEDFAM CO., LTD. (JP) | 2008-10-02 | — | — | US | disclosed |
| US-20040102344-A1 | Compostion for rust removal and method of removing rust with the same | AMTEC KABUSHIKI KAISHA (JP) | 2004-05-27 | — | — | US | disclosed |