Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL4306271

N.N.NCC(CC(=O)O)(CC(O)O)NCC(=O)O

nearest known ligand 0.34

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Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2835271 0.98 KDM4E (0.35) KDM4E
Ammonia Solution, Strong SCHEMBL5722441 0.85 KDM4E (0.41) KDM4E
SCHEMBL94667 0.82 KDM4E (0.43) KDM4E
SCHEMBL4932030 0.76 CA4 (0.31)
SCHEMBL10694560 0.69 KDM4E (0.35) KDM4E
SCHEMBL5514879 0.68 KDM4E (0.34) KDM4E
Ammonia Solution, Strong SCHEMBL15653109 0.67 ALDH1A1 (0.31)
SCHEMBL9169464 0.66 GAA (0.41) KDM4E
SCHEMBL1766196 0.65 KDM4E (0.32) KDM4E
SCHEMBL221253 0.65 ALDH1A1 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090223136-A1 Polishing compound for semiconductor wafer polishing and polishing method Nippon Chemical Industrial Co., Ltd. (50%) 2009-09-10 US disclosed
US-20080237535-A1 Composition for polishing semiconductor wafer, and method of producing the same SPEEDFAM CO., LTD. (JP) 2008-10-02 US disclosed