Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EYA2 | O00167 | 1/20 | 0.30 |
| ▸ | APP | P05067 | 1/20 | 0.30 |
| ▸ | ACE | P12821 | 1/20 | 0.30 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3716929 | 0.85 | TDP1 (0.33) | EYA2APPACETDP1 | |
| Edetic Acid SCHEMBL476467 | 0.77 | TDP1 (0.52) | EYA2APPACETDP1 | |
| SCHEMBL7752680 | 0.75 | TDP1 (0.32) | EYA2APPACETDP1 | |
| SCHEMBL6243847 | 0.75 | TDP1 (0.32) | EYA2APPACETDP1 | |
| Trimethylammonium SCHEMBL9562223 | 0.71 | HMGCR (0.43) | TDP1 | |
| SCHEMBL26361 | 0.69 | ALDH1A1 (0.45) | TDP1 | |
| Edetic Acid SCHEMBL167680 | 0.68 | TDP1 (0.64) | EYA2APPACETDP1 | |
| SCHEMBL5484809 | 0.67 | ALDH1A1 (0.43) | TDP1 | |
| SCHEMBL3796605 | 0.67 | ALDH1A1 (0.43) | TDP1 | |
| SCHEMBL702412 | 0.67 | ALDH1A1 (0.43) | TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7704307-B2 | containing water soluble palladium compound, at least one of ammonia, an amine compound, an aminocarboxylic acid compound, carboxylic acid, and bismuth; plating liquid has good stability and provides a film with excellent corrosion resistance, solder bondability, and wire bondability | NIPPON MINING & METALS CO., LTD. (JP) | 2010-04-27 | — | — | US | disclosed |
| US-20090081369-A1 | containing water soluble palladium compound, at least one of ammonia, an amine compound, an aminocarboxylic acid compound, carboxylic acid, and bismuth; plating liquid has good stability and provides a film with excellent corrosion resistance, solder bondability, and wire bondability | JX NIPPON MINING & METALS CORPORATION (JP) | 2009-03-26 | — | — | US | disclosed |