Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | C3AR1 | Q16581 | 1/20 | 0.34 |
| ▸ | TSHR | P16473 | 2/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | DPP7 | Q9UHL4 | 1/20 | 0.31 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.31 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.30 |
| ▸ | FOLH1 | Q04609 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28369850 | 0.83 | TSHR (0.34) | C3AR1TSHRMEN1GAAKMT2A | |
| SCHEMBL17747849 | 0.80 | C3AR1 (0.33) | C3AR1TSHRMEN1GAAKMT2A | |
| SCHEMBL28666851 | 0.79 | DPP7 (0.38) | C3AR1TSHRMEN1KMT2ADPP7 | |
| SCHEMBL28365523 | 0.77 | C3AR1 (0.33) | C3AR1TSHRMEN1GAAKMT2A | |
| SCHEMBL13937744 | 0.75 | ANPEP (0.40) | C3AR1MEN1GAAKMT2ADPP7 | |
| SCHEMBL6609542 | 0.74 | ALDH1A1 (0.42) | C3AR1DPP7 | |
| SCHEMBL1312061 | 0.73 | CA12 (0.41) | TSHRMEN1KMT2A | |
| SCHEMBL8370787 | 0.73 | EPHX1 (0.41) | MEN1GAAKMT2AEPHX1 | |
| SCHEMBL9850956 | 0.72 | ANPEP (0.30) | — | |
| SCHEMBL25658169 | 0.72 | TSHR (0.39) | C3AR1TSHRMEN1GAAKMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110941142-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2021-05-25 | — | — | CN | disclosed |
| CN-110941142-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2020-03-31 | — | — | CN | disclosed |
| CN-106104381-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2019-12-13 | — | — | CN | disclosed |