SCHEMBL28375445

SCHEMBL28375445

CC(C)(CCO)OC(=O)O

nearest known ligand 0.34

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
GAA P10253 1/20 0.34
TDP1 Q9NUW8 2/20 0.31
CYP4F2 P78329 1/20 0.31
CYP4A11 Q02928 1/20 0.31
FFAR1 O14842 1/20 0.30
CPT2 P23786 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1930634 0.82 GAA (0.36) GAATDP1CYP4F2CYP4A11
SCHEMBL368635 0.80 GAA (0.34) GAATDP1FFAR1CPT2
SCHEMBL5691079 0.80 GAA (0.50) GAATDP1CYP4F2CYP4A11
SCHEMBL609525 0.80 LMNA (0.39) GAATDP1FFAR1CPT2
SCHEMBL28057263 0.79
SCHEMBL1964653 0.78 GAA (0.33) GAA
SCHEMBL6136823 0.78 GAA (0.33) GAA
SCHEMBL30519921 0.78 HMGCR (0.33) GAATDP1CYP4F2CYP4A11
Hydrochloric Acid SCHEMBL11627695 0.78 LMNA (0.38) GAA
SCHEMBL28507146 0.78 LMNA (0.38) GAATDP1CYP4F2CYP4A11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111448275-B Adhesive laminate, method for producing object with resin film, and method for producing cured sealing body with cured resin film 琳得科株式会社 2022-04-22 CN disclosed
CN-110461978-B Adhesive sheet 琳得科株式会社 2022-04-19 CN disclosed
CN-110461974-B Adhesive sheet 琳得科株式会社 2022-01-18 CN disclosed
CN-110506089-B Adhesive sheet 琳得科株式会社 2022-01-18 CN disclosed
CN-110494524-B Adhesive sheet 琳得科株式会社 2022-01-18 CN disclosed
CN-110156763-B Posaconazole derivative, pharmaceutical composition and application thereof 北京国鸿生物医药科技有限公司 2021-03-23 CN disclosed
CN-112203840-A Adhesive laminate, method for using adhesive laminate, and method for manufacturing semiconductor device 琳得科株式会社 2021-01-08 CN disclosed
CN-111837219-A Method for producing processed product and adhesive laminate 琳得科株式会社 2020-10-27 CN disclosed
CN-111448275-A Adhesive laminate, method for producing object with resin film, and method for producing cured sealing body with cured resin film 琳得科株式会社 2020-07-24 CN disclosed
CN-111295739-A Method for manufacturing semiconductor device 琳得科株式会社 2020-06-16 CN disclosed
CN-111295738-A Method for manufacturing semiconductor device 琳得科株式会社 2020-06-16 CN disclosed
CN-110998799-A Method for heating and peeling object to be processed and inspected 琳得科株式会社 2020-04-10 CN disclosed