Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC6A2 | P23975 | 2/20 | 0.57 |
| ▸ | SLC6A3 | Q01959 | 2/20 | 0.57 |
| ▸ | LMNA | P02545 | 2/20 | 0.57 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.57 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.57 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.57 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.57 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.57 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.57 |
| ▸ | LTA4H | P09960 | 3/20 | 0.56 |
| ▸ | AR | P10275 | 1/20 | 0.55 |
| ▸ | MAOB | P27338 | 5/20 | 0.55 |
| ▸ | MAOA | P21397 | 2/20 | 0.55 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.55 |
| ▸ | APP | P05067 | 1/20 | 0.55 |
| ▸ | GAA | P10253 | 1/20 | 0.55 |
| ▸ | MAPT | P10636 | 1/20 | 0.55 |
| ▸ | RAB9A | P51151 | 1/20 | 0.55 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.55 |
| ▸ | MLNR | O43193 | 1/20 | 0.53 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15923575 | 0.91 | LTA4H (0.66) | SLC6A2SLC6A3LMNAHIF1ACYP1A2 | |
| Benzylphenylether SCHEMBL27588690 | 0.91 | LMNA (0.52) | SLC6A2SLC6A3LMNAHIF1ACYP1A2 | |
| SCHEMBL27974031 | 0.91 | LTA4H (0.66) | SLC6A2SLC6A3LMNAHIF1ACYP1A2 | |
| SCHEMBL30539400 | 0.89 | LTA4H (0.68) | SLC6A2SLC6A3LMNAHIF1ACYP1A2 | |
| SCHEMBL5238958 | 0.88 | LTA4H (0.66) | SLC6A2SLC6A3LMNAHIF1ACYP1A2 | |
| SCHEMBL6284506 | 0.88 | LTA4H (0.66) | LTA4HHRH3BCHEEPHX2 | |
| SCHEMBL11051776 | 0.88 | LTA4H (0.66) | LTA4HHRH3BCHEEPHX2 | |
| SCHEMBL7050035 | 0.86 | LTA4H (0.69) | SLC6A2SLC6A3LMNAHIF1ACYP1A2 | |
| SCHEMBL29773855 | 0.86 | MAOB (0.63) | LTA4HMAOBBCHE | |
| SCHEMBL6283332 | 0.85 | LTA4H (0.68) | LTA4HHRH3BCHEEPHX2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111718532-B | Resin composition, coated cable, and wire harness | 矢崎总业株式会社 | 2022-11-18 | — | — | CN | disclosed |
| CN-111148782-B | Prepreg, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-10-14 | — | — | CN | disclosed |
| CN-110366569-B | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-07-22 | — | — | CN | disclosed |
| CN-110831761-B | Metal foil-clad laminate, metal foil with resin, and wiring board | 松下知识产权经营株式会社 | 2022-07-22 | — | — | CN | disclosed |
| CN-114555360-A | Copper-clad laminate, wiring board, and resin-attached copper foil | 松下知识产权经营株式会社 | 2022-05-27 | — | — | CN | disclosed |
| CN-114555357-A | Metal-clad laminate, wiring board, metal foil with resin, and resin composition | 松下知识产权经营株式会社 | 2022-05-27 | — | — | CN | disclosed |
| CN-114430752-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-05-03 | — | — | CN | disclosed |
| CN-114423602-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-04-29 | — | — | CN | disclosed |
| CN-114402032-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-04-26 | — | — | CN | disclosed |
| CN-114207021-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-03-18 | — | — | CN | disclosed |
| CN-113795377-A | Copper-clad laminate, resin-coated copper foil, and circuit board using same | 松下知识产权经营株式会社 | 2021-12-14 | — | — | CN | disclosed |
| CN-113574102-A | Prepreg, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2021-10-29 | — | — | CN | disclosed |
| CN-112805150-A | Metal-clad laminate, wiring board, metal foil with resin, and resin composition | 松下知识产权经营株式会社 | 2021-05-14 | — | — | CN | disclosed |
| CN-112789167-A | Copper-clad laminate, wiring board, and resin-attached copper foil | 松下知识产权经营株式会社 | 2021-05-11 | — | — | CN | disclosed |
| CN-112368311-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2021-02-12 | — | — | CN | disclosed |
| CN-112020523-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2020-12-01 | — | — | CN | disclosed |
| CN-111630076-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2020-09-04 | — | — | CN | disclosed |
| CN-111148781-A | Prepreg, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2020-05-12 | — | — | CN | disclosed |
| CN-111148782-A | Prepreg, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2020-05-12 | — | — | CN | disclosed |
| CN-110831761-A | Metal-clad laminate, metal foil with resin, and wiring board | 松下知识产权经营株式会社 | 2020-02-21 | — | — | CN | disclosed |