SCHEMBL28376471

SCHEMBL28376471

Cc1cc(Cc2ccccc2)c2c(c1)-c1ccccc1[PH](=O)O2

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GPR55 Q9Y2T6 4/20 0.36
IDH1 O75874 2/20 0.33
PTGDR2 Q9Y5Y4 1/20 0.33
NPC1 O15118 3/20 0.33
RAB9A P51151 3/20 0.33
SMN1; SMN2 Q16637 3/20 0.33
HPGD P15428 1/20 0.33
CNR2 P34972 3/20 0.32
L3MBTL1 Q9Y468 2/20 0.32
MAPK1 P28482 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
BCL2 P10415 1/20 0.32
BCL2L1 Q07817 1/20 0.32
PDE3B Q13370 1/20 0.32
PDE3A Q14432 1/20 0.32
CYP3A4 P08684 1/20 0.31
CYP2D6 P10635 1/20 0.31
TSHR P16473 1/20 0.31
CYP2C19 P33261 1/20 0.31
PTGS1 P23219 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30594714 1.00 GPR55 (0.36) GPR55IDH1PTGDR2NPC1RAB9A
SCHEMBL2435459 0.86 PTPN1 (0.38) GPR55BCL2BCL2L1ELANECTRC
SCHEMBL2437141 0.84 NPC1 (0.33) NPC1RAB9ASMN1; SMN2HPGDL3MBTL1
SCHEMBL2436277 0.82 FEN1 (0.36) L3MBTL1BCL2BCL2L1CYP3A4CYP2D6
SCHEMBL30164963 0.82 FEN1 (0.36) L3MBTL1BCL2BCL2L1CYP3A4CYP2D6
SCHEMBL2431409 0.82 ELANE (0.33) SMN1; SMN2L3MBTL1MAPK1MEN1KMT2A
SCHEMBL2435285 0.81 PTPN1 (0.37) NPC1RAB9ASMN1; SMN2HPGDL3MBTL1
SCHEMBL30594730 0.79 HDAC7 (0.37) PTGDR2SMN1; SMN2HPGDL3MBTL1MAPK1
SCHEMBL28375638 0.79 HDAC7 (0.37) PTGDR2SMN1; SMN2HPGDL3MBTL1MAPK1
SCHEMBL2436919 0.76 PTPN1 (0.37) IDH1BCL2BCL2L1ELANECTRC

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110951048-B Phosphorus-containing hardener, epoxy resin composition, cured product, prepreg, and laminate 日铁化学材料株式会社 2023-09-29 CN disclosed
CN-110951048-A Phosphorus-containing curing agent, epoxy resin composition, cured product, prepreg, and laminate 日铁化学材料株式会社 2020-04-03 CN disclosed