SCHEMBL28404699

SCHEMBL28404699

CCCCCCCCCCCc1nccn1OC(=O)c1c(C(=O)OC(C)C#N)c(C(=O)O)c(C(=O)O)c(C(=O)OC(=O)c2c(C(=O)O)c(C(=O)O)c(C(=O)O)c(C(=O)O)c2C(=O)O)c1C(=O)OC(=O)c1c(C(=O)O)c(C(=O)O)c(C(=O)O)c(C(=O)O)c1C(=O)O

nearest known ligand 0.35

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.35
AGTR1 P30556 1/20 0.30
AGTR2 P50052 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Mellitic Acid SCHEMBL27720793 0.74 AGTR1 (0.35) AGTR1AGTR2
SCHEMBL27478632 0.71 AGTR1 (0.38) AGTR1AGTR2
Bromide SCHEMBL28340164 0.68 AGTR1 (0.38) ALDH1A1AGTR1AGTR2
SCHEMBL28123847 0.66 GABRP (0.38) AGTR1AGTR2
Benzoic Acid SCHEMBL28698248 0.65 AGTR1 (0.43) ALDH1A1AGTR1AGTR2
SCHEMBL9231228 0.64 TLR7 (0.36) ALDH1A1
SCHEMBL83433 0.64 TLR7 (0.36) ALDH1A1
SCHEMBL27497320 0.64 TLR7 (0.36) ALDH1A1
Hydrochloric Acid SCHEMBL28733891 0.63 TLR7 (0.35) ALDH1A1
SCHEMBL10824696 0.62 TLR7 (0.35) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114854064-A Prepreg, method for producing same, and fiber-reinforced plastic molded body 三菱化学株式会社 2022-08-05 CN disclosed
CN-110088163-B Curable resin composition, and film, molded article, prepreg, and fiber-reinforced plastic using same 三菱化学株式会社 2022-06-14 CN disclosed
CN-114072444-A Curable composition, cured product, overcoat film, flexible wiring board, and method for producing same 日保丽公司 2022-02-18 CN disclosed
CN-111836857-A Resin material, laminated structure, and multilayer printed wiring board 积水化学工业株式会社 2020-10-27 CN disclosed
CN-111836843-A Resin material and multilayer printed wiring board 积水化学工业株式会社 2020-10-27 CN disclosed
CN-111278749-A Roll packaging body 积水化学工业株式会社 2020-06-12 CN disclosed