SCHEMBL28449304

SCHEMBL28449304

CCCCOC(CCCOCCCO[SiH3])(OCCCC)OCCCC

nearest known ligand 0.38

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.38
CYP3A4 P08684 1/20 0.33
MEN1 O00255 1/20 0.31
THRB P10828 1/20 0.31
HTT P42858 1/20 0.31
KMT2A Q03164 1/20 0.31
MAPT P10636 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28722044 0.83 TSHR (0.39) TSHRCYP3A4MEN1THRBHTT
SCHEMBL28566311 0.82 THRB (0.33) TSHRMEN1THRBHTTKMT2A
SCHEMBL1608050 0.82 ADRB2 (0.33) TSHRCYP3A4
SCHEMBL3299011 0.82 TSHR (0.52) TSHRCYP3A4MEN1THRBHTT
SCHEMBL1608644 0.80 TSHR (0.50) TSHRCYP3A4MEN1THRBHTT
SCHEMBL11052663 0.77 ADRB2 (0.39) TSHRCYP3A4THRB
SCHEMBL1608865 0.75 HTT (0.50) TSHRCYP3A4MEN1THRBHTT
SCHEMBL11241966 0.75 THRB (0.33) TSHRMEN1THRBHTTKMT2A
SCHEMBL10349353 0.74 ADRB2 (0.33) TSHRCYP3A4
SCHEMBL1608067 0.73 HTT (0.54) TSHRCYP3A4MEN1THRBHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108250754-B Silicon-containing resin composition, silicon-containing resin film, silica film, light-emitting display element panel, and light-emitting display device 东京应化工业株式会社 2022-01-25 CN disclosed
CN-107709464-B Silicon-containing resin composition 东京应化工业株式会社 2021-09-28 CN disclosed
CN-112334795-A Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device 东京应化工业株式会社 2021-02-05 CN disclosed
CN-107429059-B Energy-sensitive resin composition 东京应化工业株式会社 2020-10-23 CN disclosed
CN-107922733-B Polyimide precursor composition 东京应化工业株式会社 2020-09-11 CN disclosed