SCHEMBL28469714

SCHEMBL28469714

OC1(c2cccc3c2Cc2ccccc2-3)C=CC=CC1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PNMT P11086 1/20 0.39
NPC1 O15118 2/20 0.38
RAB9A P51151 2/20 0.38
HTR7 P34969 2/20 0.35
HTR2B P41595 2/20 0.35
CYP1A2 P05177 1/20 0.33
CYP3A4 P08684 1/20 0.33
SRD5A2 P31213 1/20 0.32
KDM4E B2RXH2 1/20 0.32
ALDH1A1 P00352 1/20 0.32
LMNA P02545 1/20 0.32
MAPT P10636 1/20 0.32
HPGD P15428 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
PGR P06401 1/20 0.32
PDK2 Q15119 1/20 0.31
DRD2 P14416 1/20 0.31
ADRA1D P25100 1/20 0.31
HTR2A P28223 1/20 0.31
HTR2C P28335 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28481657 0.78 PNMT (0.37) PNMTNPC1RAB9AHTR7HTR2B
SCHEMBL28479583 0.77 RAB9A (0.38) PNMTNPC1RAB9AHTR7HTR2B
SCHEMBL28476540 0.77 PNMT (0.36) PNMTNPC1RAB9AHTR7HTR2B
SCHEMBL28470782 0.77 NPC1 (0.38) PNMTNPC1RAB9AHTR7HTR2B
SCHEMBL28444830 0.77 PNMT (0.36) PNMTNPC1RAB9AHTR7HTR2B
SCHEMBL6421730 0.74 SLC6A2 (0.40) ALDH1A1HPGDPDK2HSP90AA1
SCHEMBL28482283 0.74 RAB9A (0.36) PNMTNPC1RAB9AHTR7HTR2B
SCHEMBL27833781 0.72 RAB9A (0.38) PNMTNPC1RAB9AHTR7HTR2B
SCHEMBL28020042 0.72 MEN1 (0.35) NPC1RAB9ACYP3A4KDM4EALDH1A1
SCHEMBL28742655 0.71 PNMT (0.39) PNMTNPC1RAB9AHTR7HTR2B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111752101-A Photosensitive resin composition, cured film, substrate with cured film, and method for producing substrate with cured film 日铁化学材料株式会社 2020-10-09 CN disclosed