Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 2/20 | 0.43 |
| ▸ | MGAM | O43451 | 1/20 | 0.43 |
| ▸ | SI | P14410 | 1/20 | 0.43 |
| ▸ | MGAM2 | Q2M2H8 | 1/20 | 0.43 |
| ▸ | MIF | P14174 | 1/20 | 0.42 |
| ▸ | POLB | P06746 | 3/20 | 0.42 |
| ▸ | TSHR | P16473 | 2/20 | 0.42 |
| ▸ | LMNA | P02545 | 2/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.41 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.40 |
| ▸ | RAB9A | P51151 | 1/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.39 |
| ▸ | RECQL | P46063 | 1/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.37 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1585076 | 0.91 | LMNA (0.51) | POLBTSHRLMNAALDH1A1RAB9A | |
| SCHEMBL1961403 | 0.89 | POLB (0.46) | POLBLMNAALDH1A1L3MBTL1 | |
| SCHEMBL29878165 | 0.88 | POLB (0.45) | POLBLMNAALDH1A1L3MBTL1KMT2A | |
| SCHEMBL15236817 | 0.86 | MIF (0.37) | GAAMGAMSIMGAM2MIF | |
| SCHEMBL15236814 | 0.86 | MIF (0.37) | GAAMGAMSIMGAM2MIF | |
| SCHEMBL9544157 | 0.84 | TSHR (0.41) | GAAMGAMSIMGAM2MIF | |
| SCHEMBL7804568 | 0.83 | — | — | |
| SCHEMBL7803427 | 0.83 | — | — | |
| SCHEMBL3062283 | 0.83 | — | — | |
| SCHEMBL1965496 | 0.82 | ALDH1A1 (0.44) | GAAMGAMSIMGAM2MIF |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114603133-B | Conductive silver paste containing nano filler with multilevel structure and preparation method thereof | 苏州博濬新材料科技有限公司 | 2024-04-12 | — | — | CN | claimed |
| CN-114603133-A | Conductive silver paste containing multilevel-structure nano filler and preparation method thereof | 苏州博濬新材料科技有限公司 | 2022-06-10 | — | — | CN | claimed |
| CN-113077923-A | 5G mobile phone pad printing antenna silver paste and preparation method thereof | 苏州博濬新材料科技有限公司 | 2021-07-06 | — | — | CN | claimed |
| CN-112940564-A | Low-temperature sintering copper slurry, preparation method and application | 苏州博濬新材料科技有限公司 | 2021-06-11 | — | — | CN | claimed |
| CN-111876113-A | Delayed-curing single-component epoxy heat-conducting adhesive and use method thereof | 苏州博讯新材料科技有限公司 | 2020-11-03 | — | — | CN | claimed |
| CN-114603133-B | Conductive silver paste containing nano filler with multilevel structure and preparation method thereof | 苏州博濬新材料科技有限公司 | 2024-04-12 | — | — | CN | disclosed |
| CN-114883050-A | Low-temperature sintering copper paste based on multi-conductive network structure filler and preparation method thereof | 苏州博濬新材料科技有限公司 | 2022-08-09 | — | — | CN | disclosed |
| CN-114709004-A | Conductive silver paste and preparation method thereof | 福建省乔杨科技有限公司 | 2022-07-05 | — | — | CN | disclosed |
| CN-114603133-A | Conductive silver paste containing multilevel-structure nano filler and preparation method thereof | 苏州博濬新材料科技有限公司 | 2022-06-10 | — | — | CN | disclosed |
| CN-114058289-A | UV visbreaking adhesive and UV visbreaking adhesive tape | 宁波安特弗新材料科技有限公司 | 2022-02-18 | — | — | CN | disclosed |
| CN-113077923-A | 5G mobile phone pad printing antenna silver paste and preparation method thereof | 苏州博濬新材料科技有限公司 | 2021-07-06 | — | — | CN | disclosed |
| CN-112940564-A | Low-temperature sintering copper slurry, preparation method and application | 苏州博濬新材料科技有限公司 | 2021-06-11 | — | — | CN | disclosed |
| CN-111876113-A | Delayed-curing single-component epoxy heat-conducting adhesive and use method thereof | 苏州博讯新材料科技有限公司 | 2020-11-03 | — | — | CN | disclosed |